Copper Zinc (Cu/Zn) Sputtering Target

Product Information

Copper zinc (Cu/Zn) sputtering target is a composite material used to deposit thin films of copper and zinc in various electronic, optics, and photovoltaic applications. The combination of copper and zinc provides excellent electrical conductivity, corrosion resistance, and other mechanical properties. Cu/Zn sputtering targets are widely used in the production of photovoltaic cells, electronic circuits, and other thin films in semiconductor and material science fields.

The primary application of Cu/Zn sputtering targets is in the production of copper indium gallium selenide (CIGS) photovoltaic cells. CIGS solar cells utilize copper, indium, gallium and selenium to convert sunlight into electrical energy. Copper and zinc are used as the back contact layer, which requires high conductivity and excellent stability.

Cu/Zn sputtering targets are typically produced using the powder metallurgy process. Copper and zinc powders are mixed uniformly in a desired ratio, and then compacted under high pressure. The compacted material is then sintered at a high temperature to form a dense, uniform, and homogenous target material. The target is then machined into the required shape and size suitable for the sputtering system.

Cu/Zn sputtering targets are available in various shapes and sizes, including rectangular, circular, and custom-made shapes based on the user's requirements. Moreover, the targets can be supplied in bonded or unbonded form, depending on the sputtering system used.

In conclusion, copper zinc (Cu/Zn) sputtering targets are exceptional materials used in various applications, including photovoltaic cells, electronic circuits, and other thin films in semiconductor and material science fields. The combination of copper and zinc provides excellent mechanical, electrical, and chemical properties suitable for various film deposition needs.

Chemical Formula: Cu/Zn

CAS Number:   53801-63-1

Synonyms

Brass, Cu34Zn11, zinc-copper couple, zinc copper composite, 12682-85-8, Copper-zinc alloy, 12019-27-1, 63338-02-3

Copper Zinc (Cu/Zn)   Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size：

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Copper Zinc (Cu/Zn)  Sputtering Target

Copper Zinc (Cu/Zn)    Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Packing of Copper Zinc (Cu/Zn)  Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Copper Zinc (Cu/Zn)   Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers