Product Code : ST-Er-5N-Cu
Erbium (Er) sputtering targets are used in physical vapor deposition (PVD) processes for depositing thin films of erbium onto a substrate. Erbium is a rare earth metal that has unique optical and magnetic properties, making it attractive for a range of applications in optics, telecommunications, and data storage.
The sputtering process involves bombarding the target material with high-energy ions, which dislodge atoms from the target surface and deposit them onto a substrate to form a thin film. Erbium sputtering targets are made of high-purity erbium metal and are available in various shapes and sizes, such as round disks, rectangular tiles, and custom shapes.
Erbium sputtering targets are highly durable and provide consistent, high-quality thin films in PVD processes. They have a high melting point, good thermal conductivity, and chemical stability, which make them suitable for use in high-temperature deposition processes. Furthermore, erbium has unique optical properties, such as the ability to amplify light and create fluorescence, that make it attractive for use in fiber optic amplifiers and lasers.
Erbium sputtering targets are commonly used in the production of optical devices, such as waveguides, optical amplifiers, and laser diodes. They are also used in the manufacture of magnetic storage media, such as magnetic hard drives, magnetic tape, and magnetic memory devices.
Erbium sputtering targets are critical components in many high-tech industries, including telecommunications, data storage, and consumer electronics, due to their unique optical and magnetic properties.
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Product Information
Erbium (Er) sputtering targets are used in physical vapor deposition (PVD) processes for depositing thin films of erbium onto a substrate. Erbium is a rare earth metal that has unique optical and magnetic properties, making it attractive for a range of applications in optics, telecommunications, and data storage.
The sputtering process involves bombarding the target material with high-energy ions, which dislodge atoms from the target surface and deposit them onto a substrate to form a thin film. Erbium sputtering targets are made of high-purity erbium metal and are available in various shapes and sizes, such as round disks, rectangular tiles, and custom shapes.
Erbium sputtering targets are highly durable and provide consistent, high-quality thin films in PVD processes. They have a high melting point, good thermal conductivity, and chemical stability, which make them suitable for use in high-temperature deposition processes. Furthermore, erbium has unique optical properties, such as the ability to amplify light and create fluorescence, that make it attractive for use in fiber optic amplifiers and lasers.
Erbium sputtering targets are commonly used in the production of optical devices, such as waveguides, optical amplifiers, and laser diodes. They are also used in the manufacture of magnetic storage media, such as magnetic hard drives, magnetic tape, and magnetic memory devices.
Erbium sputtering targets are critical components in many high-tech industries, including telecommunications, data storage, and consumer electronics, due to their unique optical and magnetic properties.
Chemical Formula: Er
CAS Number: 7440-52-0
Synonyms
N/A
Erbium (Er) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
Properties(Theoretical)
Molecular Weight | 382.56 |
Appearance | Silvery |
Melting Point | 1497°C |
Boiling Point | 2868°C |
Density | 9066 kg/m³ |
Solubility in H2O | N/A |
Electrical Resistivity | 107.0 microhm-cm @ 25°C |
Electronegativity | 1.2 Paulings |
Heat of Vaporization | 67 K-Cal/gm atom at 2863°C |
Poisson's Ratio | 0.237 |
Specific Heat | 0.0401 Cal/g/K @ 25°C |
Tensile Strength | N/A |
Thermal Conductivity | 0.145 W/cm/K @ 298.2 K |
Thermal Expansion | (r.t.) (poly) 12.2 µm/(m·K) |
Vickers Hardness | 589 MPa |
Young's Modulus | 69.9 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Erbium (Er) Sputtering Target
Erbium (Er) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Erbium (Er) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Erbium (Er) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Er |
MDL Number | MFCD00010987 |
EC No. | 231-160-1 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 23980 |
SMILES | [Er] |
InchI Identifier | InChI=1S/Er |
InchI Key | UYAHIZSMUZPPFV-UHFFFAOYSA-N |