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Erbium (Er) Sputtering Target

Product Code : ST-Er-5N-Cu

Erbium (Er) sputtering targets are used in physical vapor deposition (PVD) processes for depositing thin films of erbium onto a substrate. Erbium is a rare earth metal that has unique optical and magnetic properties, making it attractive for a range of applications in optics, telecommunications, and data storage.

The sputtering process involves bombarding the target material with high-energy ions, which dislodge atoms from the target surface and deposit them onto a substrate to form a thin film. Erbium sputtering targets are made of high-purity erbium metal and are available in various shapes and sizes, such as round disks, rectangular tiles, and custom shapes.

Erbium sputtering targets are highly durable and provide consistent, high-quality thin films in PVD processes. They have a high melting point, good thermal conductivity, and chemical stability, which make them suitable for use in high-temperature deposition processes. Furthermore, erbium has unique optical properties, such as the ability to amplify light and create fluorescence, that make it attractive for use in fiber optic amplifiers and lasers.

Erbium sputtering targets are commonly used in the production of optical devices, such as waveguides, optical amplifiers, and laser diodes. They are also used in the manufacture of magnetic storage media, such as magnetic hard drives, magnetic tape, and magnetic memory devices.

Erbium sputtering targets are critical components in many high-tech industries, including telecommunications, data storage, and consumer electronics, due to their unique optical and magnetic properties.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Erbium (Er) Sputtering Target ST-Er-2N-Cu 99% Customize
Erbium (Er) Sputtering Target ST-Er-3N-Cu 99.9% Customize
Erbium (Er) Sputtering Target ST-Er-4N-Cu 99.99% Customize
Erbium (Er) Sputtering Target ST-Er-5N-Cu 99.999% Customize

Product Information

Erbium (Er) sputtering targets are used in physical vapor deposition (PVD) processes for depositing thin films of erbium onto a substrate. Erbium is a rare earth metal that has unique optical and magnetic properties, making it attractive for a range of applications in optics, telecommunications, and data storage.

The sputtering process involves bombarding the target material with high-energy ions, which dislodge atoms from the target surface and deposit them onto a substrate to form a thin film. Erbium sputtering targets are made of high-purity erbium metal and are available in various shapes and sizes, such as round disks, rectangular tiles, and custom shapes.

Erbium sputtering targets are highly durable and provide consistent, high-quality thin films in PVD processes. They have a high melting point, good thermal conductivity, and chemical stability, which make them suitable for use in high-temperature deposition processes. Furthermore, erbium has unique optical properties, such as the ability to amplify light and create fluorescence, that make it attractive for use in fiber optic amplifiers and lasers.

Erbium sputtering targets are commonly used in the production of optical devices, such as waveguides, optical amplifiers, and laser diodes. They are also used in the manufacture of magnetic storage media, such as magnetic hard drives, magnetic tape, and magnetic memory devices.

Erbium sputtering targets are critical components in many high-tech industries, including telecommunications, data storage, and consumer electronics, due to their unique optical and magnetic properties.

Chemical Formula: Er
CAS Number: 7440-52-0


Synonyms

N/A


Erbium (Er) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Properties(Theoretical)

Molecular Weight382.56
AppearanceSilvery
Melting Point1497°C
Boiling Point2868°C
Density9066 kg/m³
Solubility in H2ON/A
Electrical Resistivity107.0 microhm-cm @ 25°C
Electronegativity1.2 Paulings
Heat of Vaporization67 K-Cal/gm atom at 2863°C
Poisson's Ratio0.237
Specific Heat0.0401 Cal/g/K @ 25°C
Tensile StrengthN/A
Thermal Conductivity0.145 W/cm/K @ 298.2 K
Thermal Expansion(r.t.) (poly) 12.2 µm/(m·K)
Vickers Hardness589 MPa
Young's Modulus69.9 GPa




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Erbium (Er) Sputtering Target

Erbium (Er)  Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Erbium (Er) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Erbium (Er)  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifiers

Linear FormulaEr
MDL NumberMFCD00010987
EC No.231-160-1
Beilstein/Reaxys No.N/A
Pubchem CID23980
SMILES[Er]
InchI IdentifierInChI=1S/Er
InchI KeyUYAHIZSMUZPPFV-UHFFFAOYSA-N




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