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Erbium Fluoride (ErF3) Sputtering Target

Product Code : ST-ErF3-5N-Cu

Erbium Fluoride (ErF3) Sputtering Target is a specialized thin film deposition material used in physical vapor deposition (PVD) processes. It is commonly utilized in industries such as semiconductor, optical coating, and research and development.

ErF3 sputtering targets are made of high-purity Erbium Fluoride (ErF3) material and are designed to be compatible with various sputtering systems, such as magnetron sputtering and RF sputtering. These targets are typically circular or rectangular in shape and are available in different sizes and dimensions.

Erbium fluoride, with the chemical formula ErF3, is a compound consisting of erbium and fluorine. It is known for its excellent optical properties, including emission and absorption of specific wavelengths of light. ErF3 targets are used to deposit thin films of erbium fluoride onto substrates, providing them with desired optical properties such as amplification or frequency conversion.

Some key properties and advantages of ErF3 sputtering targets include high purity, good film adhesion, excellent uniformity, and precise control over film properties. These targets are engineered to have controlled composition and grain structure, ensuring reproducible film properties.

In summary, ErF3 sputtering targets are essential for the production of advanced optical devices and coatings, playing a significant role in enabling the development of technologies such as laser systems, fiber optics, and photonic devices.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Erbium Fluoride (ErF3) Sputtering Target ST-ErF3-2N-Cu 99% Customize
Erbium Fluoride (ErF3) Sputtering Target ST-ErF3-3N-Cu 99.9% Customize
Erbium Fluoride (ErF3) Sputtering Target ST-ErF3-4N-Cu 99.99% Customize
Erbium Fluoride (ErF3) Sputtering Target ST-ErF3-5N-Cu 99.999% Customize

Product Information

Erbium Fluoride (ErF3) Sputtering Target is a specialized thin film deposition material used in physical vapor deposition (PVD) processes. It is commonly utilized in industries such as semiconductor, optical coating, and research and development.

ErF3 sputtering targets are made of high-purity Erbium Fluoride (ErF3) material and are designed to be compatible with various sputtering systems, such as magnetron sputtering and RF sputtering. These targets are typically circular or rectangular in shape and are available in different sizes and dimensions.

Erbium fluoride, with the chemical formula ErF3, is a compound consisting of erbium and fluorine. It is known for its excellent optical properties, including emission and absorption of specific wavelengths of light. ErF3 targets are used to deposit thin films of erbium fluoride onto substrates, providing them with desired optical properties such as amplification or frequency conversion.

Some key properties and advantages of ErF3 sputtering targets include high purity, good film adhesion, excellent uniformity, and precise control over film properties. These targets are engineered to have controlled composition and grain structure, ensuring reproducible film properties.

In summary, ErF3 sputtering targets are essential for the production of advanced optical devices and coatings, playing a significant role in enabling the development of technologies such as laser systems, fiber optics, and photonic devices.

Chemical Formula: ErF3

CAS Number:  13760-83-3


Erbium Fluoride (ErF3) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”



Porperties(Theoretical)

Compound FormulaErF3
Molecular Weight224.28
AppearancePink
Melting Point1350 °C (2462 °F)
Boiling Point2200 °C (3992 °F)
Density7.820g/cm3
Solubility in H2ON/A
Exact Mass222.926 g/mol
Monoisotopic Mass222.92551 Da




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Erbium Fluoride (ErF3) Sputtering Target

Erbium Fluoride (ErF3) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Erbium Fluoride (ErF3) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Erbium Fluoride (ErF3)Calcium Fluoride (CaF2)  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifier

Linear FormulaErF3
MDL NumberMFCD00016074
EC No.237-356-3
Beilstein/Reaxys No.N/A
Pubchem CID83713
IUPAC NameTrifluoroerbium
SMILESF[Er](F)F
InchI IdentifierInChI=1S/Er.3FH/h;3*1H/q+3;;;/p-3
InchI KeyQGJSAGBHFTXOTM-UHFFFAOYSA-K




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