Product Code : ST-Hf-5N-Cu
The hafnium (Hf) sputtering target is an extremely pure, high-density target material widely used for various thin-film deposition processes. The hafnium target has an excellent electrical conductivity, making it an ideal sputtering material. In addition, its good thermal and chemical stability make this material highly suitable for reactive sputtering applications. Hf targets are mainly used as targets for Plasma Enhanced Chemical Vapor Deposition (PECVD) and Physical Vapor Deposition (PVD) processes. Its good electrical conductivity also makes Hf sputtering targets suitable for magnetron sputtering. This material is mainly used to create thin films for semiconductors, optical coatings and multimedia applications.
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Product Information
The hafnium (Hf) sputtering target is an extremely pure, high-density target material widely used for various thin-film deposition processes. The hafnium target has an excellent electrical conductivity, making it an ideal sputtering material. In addition, its good thermal and chemical stability make this material highly suitable for reactive sputtering applications. Hf targets are mainly used as targets for Plasma Enhanced Chemical Vapor Deposition (PECVD) and Physical Vapor Deposition (PVD) processes. Its good electrical conductivity also makes Hf sputtering targets suitable for magnetron sputtering. This material is mainly used to create thin films for semiconductors, optical coatings and multimedia applications.
Chemical Formula: Hf
CAS Number: 7440-58-6
Synonyms
N/A
Hafnium (Hf) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
Properties(Theoretical)
Molecular Weight | 178.49 |
Appearance | Silver |
Melting Point | 2227°C |
Boiling Point | 4602°C |
Density | 13.31 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 35.1 microhm-cm @ 25°C |
Electronegativity | 1.3 Paulings |
Heat of Vaporization | 155 K-Cal/gm atom at 4602°C |
Poisson's Ratio | 0.37 |
Specific Heat | 0.035 Cal/g/K @ 25 °C |
Tensile Strength | N/A |
Thermal Conductivity | 0.230 W/cm/K @ 298.2 K |
Thermal Expansion | (25 °C) 5.9 µm·m-1·K-1 |
Vickers Hardness | 1760 MPa |
Young's Modulus | 78 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Hafnium (Hf) Sputtering Target
Hafnium (Hf) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Hafnium (Hf) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Hafnium (Hf) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Hf |
MDL Number | MFCD00011032 |
EC No. | 231-166-4 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 23986 |
SMILES | [Hf] |
InchI Identifier | InChI=1S/Hf |
InchI Key | VBJZVLUMGGDVMO-UHFFFAOYSA-N |