Product Code : ST-In-7N-Cu
An indium (In) sputtering target is a material that is used in the process of sputtering, a deposition process used to deposit thin layers of material onto a substrate. The sputtering target consists of pure indium, or an alloy of indium with other elements, such as aluminum, bismuth, or gallium. It is typically formed into a pellet or disk, and bombarded with accelerated ions from an ion source to chip off small particles of the target material, which are then deposited onto the substrate surface. Indium sputtering targets are used in a wide variety of industrial and scientific applications, including fabricating optical thin film coatings, metal contacts for electronic components, and various components in the aerospace, automotive, and medical sectors.
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Product Information
An indium (In) sputtering target is a material that is used in the process of sputtering, a deposition process used to deposit thin layers of material onto a substrate. The sputtering target consists of pure indium, or an alloy of indium with other elements, such as aluminum, bismuth, or gallium. It is typically formed into a pellet or disk, and bombarded with accelerated ions from an ion source to chip off small particles of the target material, which are then deposited onto the substrate surface. Indium sputtering targets are used in a wide variety of industrial and scientific applications, including fabricating optical thin film coatings, metal contacts for electronic components, and various components in the aerospace, automotive, and medical sectors.
Chemical Formula: In
CAS Number: 7440-74-6
Synonyms
Indium sputter target, 40851, 40852, 40853
Indium (In) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
Properties(Theoretical)
Molecular Weight | 114.82 |
Appearance | Silvery |
Melting Point | 156.6 °C |
Boiling Point | 2080°C |
Density | 7310 kg/m3 |
Solubility in H2O | N/A |
Electrical Resistivity | 8.37 microhm-cm @ 20°C |
Electronegativity | 1.7 Paulings |
Heat of Vaporization | 53.7 K-Cal/gm atom at 2080 °C |
Poisson's Ratio | 0.4498 |
Specific Heat | 0.056 Cal/g/K @ 25°C |
Tensile Strength | N/A |
Thermal Conductivity | 0.818 W/cm/K @ 298.2 K |
Thermal Expansion | (25 °C) 32.1 µm·m-1·K-1 |
Vickers Hardness | <10 |
Young's Modulus | 11 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Indium (In) Sputtering Target
Indium (In) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Indium (In) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Indium (In) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | In |
MDL Number | MFCD00134048 |
EC No. | 231-180-0 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | N/A |
SMILES | [In] |
InchI Identifier | InChI=1S/In |
InchI Key | APFVFJFRJDLVQX-UHFFFAOYSA-N |