Product Code : ST-Fe3C-5N-Cu
Iron carbide (Fe3C) sputtering targets are used in the manufacture of thin films for a range of electronic applications. Iron carbide is a compound formed from iron and carbon and is known for its hardness, high melting point, and resistance to wear. These properties make it attractive for use in the production of electronic devices, particularly in magnetic storage media and hard drives.
Sputtering is a process used to produce thin films of a material by bombarding a target material with high-energy particles in a vacuum chamber, causing atoms or molecules to be ejected from the target and deposited onto a substrate material. Fe3C sputtering targets are typically made using powder metallurgy techniques where high-purity Fe3C powder is mixed with a binder material, pressed into a disc or other desired shape, and then sintered at high temperatures to create a dense and uniform target material.
The quality of the Fe3C sputtering target used in the sputtering process has a significant impact on the quality and properties of the thin films produced. The purity, grain size, and uniformity of the target determine the quality and thickness of the thin films produced as well as their magnetic and mechanical properties. Fe3C sputtering targets are available in various sizes and shapes and can be customized according to specific requirements.
In summary, Fe3C sputtering targets play a critical role in the production of electronic devices such as magnetic storage media and hard drives. By controlling the purity, grain size, and uniformity of the target material, the properties and quality of the thin films produced can be optimized, resulting in better-performing electronic devices.
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Product Information
Iron carbide (Fe3C) sputtering targets are used in the manufacture of thin films for a range of electronic applications. Iron carbide is a compound formed from iron and carbon and is known for its hardness, high melting point, and resistance to wear. These properties make it attractive for use in the production of electronic devices, particularly in magnetic storage media and hard drives.
Sputtering is a process used to produce thin films of a material by bombarding a target material with high-energy particles in a vacuum chamber, causing atoms or molecules to be ejected from the target and deposited onto a substrate material. Fe3C sputtering targets are typically made using powder metallurgy techniques where high-purity Fe3C powder is mixed with a binder material, pressed into a disc or other desired shape, and then sintered at high temperatures to create a dense and uniform target material.
The quality of the Fe3C sputtering target used in the sputtering process has a significant impact on the quality and properties of the thin films produced. The purity, grain size, and uniformity of the target determine the quality and thickness of the thin films produced as well as their magnetic and mechanical properties. Fe3C sputtering targets are available in various sizes and shapes and can be customized according to specific requirements.
In summary, Fe3C sputtering targets play a critical role in the production of electronic devices such as magnetic storage media and hard drives. By controlling the purity, grain size, and uniformity of the target material, the properties and quality of the thin films produced can be optimized, resulting in better-performing electronic devices.
Chemical Formula: Fe3C
CAS Number: 12011-67-5
Iron Carbide (Fe3C) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Compound Formula | CFe3 |
| Molecular Weight | 179.55 |
| Appearance | solid |
| Melting Point | 1227 °C (2241 °F) |
| Boiling Point | °C (°F) |
| Density | 7.694 g/cm3 |
| Solubility in H2O | N/A |
| Exact Mass | N/A |
| Monoisotopic Mass | N/A |
| Charge | N/A |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Iron Carbide (Fe3C)Sputtering Target
Iron Carbide (Fe3C) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Iron Carbide (Fe3C)Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Iron Carbide (Fe3C) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
