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Lead (Pb) Sputtering Target

Product Code : ST-Pb-7N-Cu

Lead sputtering targets are commonly used for producing thin-film coatings of lead for industrial, medical, and scientific applications. These coats are used on a variety of materials such as glass, ceramics, plastics, and rubber. Lead sputtering targets can also be used to create lead shields for imaging and radiation protection in healthcare settings and X-ray-sensitive laboratories. Lead is an ideal material for sputtering target applications because it has a high sputtering rate, can be produced in large sizes, and has a low price.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Lead (Pb) Sputtering Target ST-Pb-2N-Cu 99% Customize
Lead (Pb) Sputtering Target ST-Pb-4N-Cu 99.99% Customize
Lead (Pb) Sputtering Target ST-Pb-6N-Cu 99.9999% Customize
Lead (Pb) Sputtering Target ST-Pb-7N-Cu 99.99999% Customize

Product Information

Lead sputtering targets are commonly used for producing thin-film coatings of lead for industrial, medical, and scientific applications. These coats are used on a variety of materials such as glass, ceramics, plastics, and rubber. Lead sputtering targets can also be used to create lead shields for imaging and radiation protection in healthcare settings and X-ray-sensitive laboratories. Lead is an ideal material for sputtering target applications because it has a high sputtering rate, can be produced in large sizes, and has a low price.

Chemical Formula: Pb
CAS Number:    7439-92-1


Synonyms

N/A


Lead (Pb) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”



Properties(Theoretical)

Molecular Weight207.2
AppearanceBluish white
Melting Point327.502°C
Boiling Point1740°C
Density11.35 g/cm3
Solubility in H2ON/A
Electrical Resistivity20.648 microhm-cm @ 20 °C
Electronegativity1.8 Paulings
Heat of Vaporization42.4 K-Cal/gm atom at 1740°C
Poisson's Ratio0.44
Specific Heat0.038 Cal/g/oK @ 25°C
Tensile StrengthN/A
Thermal Conductivity0.353 W/cm/K @ 298.2 K
Thermal Expansion(25 °C) 28.9 µm·m-1·K-1
Vickers HardnessN/A
Young's Modulus16 GPa




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Lead (Pb)  Sputtering Target

Lead (Pb)   Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Lead (Pb)   Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Lead (Pb)   Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifiers

Linear FormulaPb
MDL NumberMFCD00134050
EC No.231-100-4
Beilstein/Reaxys No.N/A
Pubchem CID5352425
SMILES[Pb]
InchI IdentifierInChI=1S/Pb
InchI KeyWABPQHHGFIMREM-UHFFFAOYSA-N




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