Product Code : ST-Pb-7N-Cu
Lead sputtering targets are commonly used for producing thin-film coatings of lead for industrial, medical, and scientific applications. These coats are used on a variety of materials such as glass, ceramics, plastics, and rubber. Lead sputtering targets can also be used to create lead shields for imaging and radiation protection in healthcare settings and X-ray-sensitive laboratories. Lead is an ideal material for sputtering target applications because it has a high sputtering rate, can be produced in large sizes, and has a low price.
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Product Information
Lead sputtering targets are commonly used for producing thin-film coatings of lead for industrial, medical, and scientific applications. These coats are used on a variety of materials such as glass, ceramics, plastics, and rubber. Lead sputtering targets can also be used to create lead shields for imaging and radiation protection in healthcare settings and X-ray-sensitive laboratories. Lead is an ideal material for sputtering target applications because it has a high sputtering rate, can be produced in large sizes, and has a low price.
Chemical Formula: Pb
CAS Number: 7439-92-1
Synonyms
N/A
Lead (Pb) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Molecular Weight | 207.2 |
| Appearance | Bluish white |
| Melting Point | 327.502°C |
| Boiling Point | 1740°C |
| Density | 11.35 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 20.648 microhm-cm @ 20 °C |
| Electronegativity | 1.8 Paulings |
| Heat of Vaporization | 42.4 K-Cal/gm atom at 1740°C |
| Poisson's Ratio | 0.44 |
| Specific Heat | 0.038 Cal/g/oK @ 25°C |
| Tensile Strength | N/A |
| Thermal Conductivity | 0.353 W/cm/K @ 298.2 K |
| Thermal Expansion | (25 °C) 28.9 µm·m-1·K-1 |
| Vickers Hardness | N/A |
| Young's Modulus | 16 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Lead (Pb) Sputtering Target
Lead (Pb) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Lead (Pb) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Lead (Pb) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Pb |
| MDL Number | MFCD00134050 |
| EC No. | 231-100-4 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 5352425 |
| SMILES | [Pb] |
| InchI Identifier | InChI=1S/Pb |
| InchI Key | WABPQHHGFIMREM-UHFFFAOYSA-N |
