Product Code : ST-Mn/Cu-5N-Cu
Manganese Copper (Mn/Cu) Sputtering Target is a material used in the process of sputtering, which is the process of depositing a thin film of material onto a substrate. Mn/Cu sputtering targets are made by alloying manganese and copper in specific ratios and then casting the material into a target of desired size and shape. These targets are widely used in applications such as thin-film transistors, solar cells, and magnetic storage media. Mn/Cu sputtering targets are known for their high purity, uniformity, and consistency, making them an ideal choice for high-quality thin-film deposition.
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Product Information
Manganese Copper (Mn/Cu) Sputtering Target is a material used in the process of sputtering, which is the process of depositing a thin film of material onto a substrate. Mn/Cu sputtering targets are made by alloying manganese and copper in specific ratios and then casting the material into a target of desired size and shape. These targets are widely used in applications such as thin-film transistors, solar cells, and magnetic storage media. Mn/Cu sputtering targets are known for their high purity, uniformity, and consistency, making them an ideal choice for high-quality thin-film deposition.
Chemical Formula: Mn/Cu
CAS Number: 12272-98-9
Synonyms
CAS 12272-98-9, Copper-Manganese master alloy
Manganese Copper (Mn/Cu) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Compound Formula | MnCu |
| Appearance | Target |
| Melting Point | N/A |
| Boiling Point | N/A |
| Density | N/A |
| Solubility in H2O | N/A |
| Monoisotopic Mass | 117.868 g/mol |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Manganese Copper (Mn/Cu) Sputtering Target
Manganese Copper (Mn/Cu) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Manganese Copper (Mn/Cu) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Manganese Copper (Mn/Cu) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifier
| Linear Formula | Mn/Cu |
| MDL Number | N/A |
| EC No. | N/A |
| Pubchem CID | 11446311 |
| IUPAC Name | copper; manganese |
| SMILES | [Mn].[Cu] |
| InchI Identifier | InChI=1S/Cu.Mn |
| InchI Key | HPDFFVBPXCTEDN-UHFFFAOYSA-N |
