Product Code : ST-Mo2C-5N-Cu
Molybdenum carbide (Mo2C) sputtering targets are used in the production of thin films for a range of electronic and coating applications. Molybdenum carbide is a refractory metal compound known for its high melting point, strength, and resistance to wear and abrasion, which makes it ideal for use in harsh environments.
Sputtering is a widely used technique used to produce thin films of materials by bombarding the target material with high-energy ions, sputtering off atoms or molecules that are deposited onto a substrate material. Mo2C sputtering targets are typically made using powder metallurgy techniques, in which high-purity Mo2C powder is mixed with a binder material, pressed into a required target shape, and then sintered at high temperatures to create a dense and uniform target material.
The quality of Mo2C sputtering targets is paramount in the production of thin films of high quality. The properties of the target, including its purity, density, and uniformity, influence the properties of the thin films that are deposited, such as the film's thickness, adhesion, mechanical properties, and electrical conductivity. Different sizes and shapes of Mo2C sputtering targets are available in the market, and they can be customized to meet specific customer requirements.
In summary, Mo2C sputtering targets play a significant role in the production of thin films used in electronic and coating applications due to their strength, hardness, and durability. Maintaining a high level of quality in the target material is critical to ensure that the deposited thin films exhibit the desired properties and meet the device manufacturer's specifications.
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Product Information
Molybdenum carbide (Mo2C) sputtering targets are used in the production of thin films for a range of electronic and coating applications. Molybdenum carbide is a refractory metal compound known for its high melting point, strength, and resistance to wear and abrasion, which makes it ideal for use in harsh environments.
Sputtering is a widely used technique used to produce thin films of materials by bombarding the target material with high-energy ions, sputtering off atoms or molecules that are deposited onto a substrate material. Mo2C sputtering targets are typically made using powder metallurgy techniques, in which high-purity Mo2C powder is mixed with a binder material, pressed into a required target shape, and then sintered at high temperatures to create a dense and uniform target material.
The quality of Mo2C sputtering targets is paramount in the production of thin films of high quality. The properties of the target, including its purity, density, and uniformity, influence the properties of the thin films that are deposited, such as the film's thickness, adhesion, mechanical properties, and electrical conductivity. Different sizes and shapes of Mo2C sputtering targets are available in the market, and they can be customized to meet specific customer requirements.
In summary, Mo2C sputtering targets play a significant role in the production of thin films used in electronic and coating applications due to their strength, hardness, and durability. Maintaining a high level of quality in the target material is critical to ensure that the deposited thin films exhibit the desired properties and meet the device manufacturer's specifications.
Chemical Formula:Mo2C
CAS Number: 12069-89-5
Molybdenum Carbide (Mo2C) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
(Theoretical)
Compound Formula | CMo2 |
Molecular Weight | 203.89 |
Appearance | gray |
Melting Point | 2690 °C (4874 °F) |
Boiling Point | N/A |
Density | 9.18 g/cm3 |
Solubility in H2O | N/A |
Exact Mass | N/A |
Monoisotopic Mass | N/A |
Charge | N/A |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Molybdenum Carbide (Mo2C) Sputtering Target
Molybdenum Carbide (Mo2C) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Molybdenum Carbide (Mo2C) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Molybdenum Carbide (Mo2C) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Mo2C |
MDL Number | MFCD00014218 |
EC No. | 235-115-7 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | N/A |
IUPAC Name | N/A |
SMILES | C(=[Mo])=[Mo] |
InchI Identifier | InChI=1S/C.2Mo |
InchI Key | QIJNJJZPYXGIQM-UHFFFAOYSA-N |