Product Code : ST-Ni/Cu-5N-Cu
Nickel Copper (Ni/Cu) sputtering target is a high purity material used in thin film deposition processes for the production of semiconductors, photovoltaics, decorative coatings, and many other applications. The target is composed of a mixture of nickel and copper in a specific ratio and is bonded to a backing plate to ensure uniformity in film deposition.
Ni/Cu sputtering target is used in physical vapor deposition (PVD) processes where a high-energy plasma stream is directed towards the target material, which results in the ejection of atoms from the target surface. These atoms then travel through the vacuum chamber and deposit onto a substrate, forming a thin film. The properties of the deposited film depend on the composition of the sputtering target, the plasma conditions, and the deposition parameters.
Some of the key benefits of using Ni/Cu sputtering targets include excellent electrical conductivity, good corrosion resistance, and high thermal stability. These properties make it an ideal material for use in electronic devices, as well as for specialized coatings and other industrial applications.
Ni/Cu sputtering targets are available in various shapes and sizes, including cylindrical, rectangular, and circular. They can also be customized to meet specific customer requirements for composition, purity, and other properties.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
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Product Information
Nickel Copper (Ni/Cu) sputtering target is a high purity material used in thin film deposition processes for the production of semiconductors, photovoltaics, decorative coatings, and many other applications. The target is composed of a mixture of nickel and copper in a specific ratio and is bonded to a backing plate to ensure uniformity in film deposition.
Ni/Cu sputtering target is used in physical vapor deposition (PVD) processes where a high-energy plasma stream is directed towards the target material, which results in the ejection of atoms from the target surface. These atoms then travel through the vacuum chamber and deposit onto a substrate, forming a thin film. The properties of the deposited film depend on the composition of the sputtering target, the plasma conditions, and the deposition parameters.
Some of the key benefits of using Ni/Cu sputtering targets include excellent electrical conductivity, good corrosion resistance, and high thermal stability. These properties make it an ideal material for use in electronic devices, as well as for specialized coatings and other industrial applications.
Ni/Cu sputtering targets are available in various shapes and sizes, including cylindrical, rectangular, and circular. They can also be customized to meet specific customer requirements for composition, purity, and other properties.
Chemical Formula: Ni/Cu
Nickel Copper (Ni/Cu) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Nickel Copper (Ni/Cu) Sputtering Target
Nickel Copper (Ni/Cu) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Nickel Copper (Ni/Cu) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Nickel Copper (Ni/Cu) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
