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Nickel Manganese (Ni/Mn) Sputtering Target

Product Code : ST-Ni/Mn-5N-Cu

Nickel Manganese (Ni/Mn) sputtering target is a high purity material used in thin film deposition processes for the production of magnetic materials, electronic devices, and other applications. The target is composed of a mixture of nickel and manganese in a specific ratio and is bonded to a backing plate to ensure uniformity in film deposition.

Ni/Mn sputtering targets are commonly used in physical vapor deposition (PVD) processes where a high-energy plasma stream is directed towards the target material, which results in the ejection of atoms from the target surface. These atoms then travel through the vacuum chamber and deposit onto a substrate, forming a thin film. The properties of the deposited film depend on the composition of the sputtering target, the plasma conditions, and the deposition parameters.

Some of the key benefits of using Ni/Mn sputtering targets include excellent magnetic properties, high corrosion resistance, and thermal stability. These properties make it an ideal material for use in producing magnetic recording media for hard drives, sensors, and other high-tech devices.

Ni/Mn sputtering targets are available in various sizes and shapes, including cylindrical, rectangular, and circular. They can also be customized to meet specific customer requirements for composition, purity, and other properties.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Nickel Manganese (Ni/Mn) Sputtering Target ST-Ni/Mn-2N-Cu 99% Customize
Nickel Manganese (Ni/Mn) Sputtering Target ST-Ni/Mn-3N-Cu 99.9% Customize
Nickel Manganese (Ni/Mn) Sputtering Target ST-Ni/Mn-4N-Cu 99.99% Customize
Nickel Manganese (Ni/Mn) Sputtering Target ST-Ni/Mn-5N-Cu 99.999% Customize

Product Information

Nickel Manganese (Ni/Mn) sputtering target is a high purity material used in thin film deposition processes for the production of magnetic materials, electronic devices, and other applications. The target is composed of a mixture of nickel and manganese in a specific ratio and is bonded to a backing plate to ensure uniformity in film deposition.

Ni/Mn sputtering targets are commonly used in physical vapor deposition (PVD) processes where a high-energy plasma stream is directed towards the target material, which results in the ejection of atoms from the target surface. These atoms then travel through the vacuum chamber and deposit onto a substrate, forming a thin film. The properties of the deposited film depend on the composition of the sputtering target, the plasma conditions, and the deposition parameters.

Some of the key benefits of using Ni/Mn sputtering targets include excellent magnetic properties, high corrosion resistance, and thermal stability. These properties make it an ideal material for use in producing magnetic recording media for hard drives, sensors, and other high-tech devices.

Ni/Mn sputtering targets are available in various sizes and shapes, including cylindrical, rectangular, and circular. They can also be customized to meet specific customer requirements for composition, purity, and other properties.

Chemical Formula: Ni/Mn




Nickel Manganese (Ni/Mn)  Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”



Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Nickel Manganese (Ni/Mn) Sputtering Target

Nickel Manganese (Ni/Mn)  Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Nickel Manganese (Ni/Mn)  Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Nickel Manganese (Ni/Mn)  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.



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