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Nickel Tungsten (Ni/W) Sputtering Target

Product Code : ST-Ni/W-5N-Cu

Nickel Tungsten (Ni/W) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ni/W sputtering targets are commonly used in the production of thin film magnetic heads for hard disk drives (HDDs) and magneto-resistive random access memory (MRAM) devices. Ni/W sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity, making it a popular choice in many industries.

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Nickel Tungsten (Ni/W) Sputtering Target ST-Ni/W-2N-Cu 99% Customize
Nickel Tungsten (Ni/W) Sputtering Target ST-Ni/W-3N-Cu 99.9% Customize
Nickel Tungsten (Ni/W) Sputtering Target ST-Ni/W-4N-Cu 99.99% Customize
Nickel Tungsten (Ni/W) Sputtering Target ST-Ni/W-5N-Cu 99.999% Customize

Product Information

Nickel Tungsten (Ni/W) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ni/W sputtering targets are commonly used in the production of thin film magnetic heads for hard disk drives (HDDs) and magneto-resistive random access memory (MRAM) devices. Ni/W sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity, making it a popular choice in many industries.

Chemical Formula:Ni/W
CAS Number:  51890-28-9

Synonyms

Nickel-wolfram, NiW, WNi2, WNi3, NiW3, CAS 12384-50-8, CAS 12260-61-6, CAS 304021-50-9


Nickel Tungsten (Ni/W) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Properties(Theoretical)

Compound FormulaWNi
AppearanceMetallic solid
Melting Point1500 °C
Boiling PointN/A
DensityN/A
Solubility in H2ON/A
Monoisotopic Mass241.886 g/mol




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Nickel Tungsten (Ni/W) Sputtering Target

Nickel Tungsten (Ni/W) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Nickel Tungsten (Ni/W) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Nickel Tungsten (Ni/W) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifiers

Linear FormulaW/Ni
MDL NumberN/A
EC No.N/A
Pubchem CID13066886
IUPAC Namenickel; tungsten
SMILES[Ni].[W]
InchI IdentifierInChI=1S/Ni.W
InchI KeyMOWMLACGTDMJRV-UHFFFAOYSA-N




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