Product Code : ST-Ni/W-5N-Cu
Nickel Tungsten (Ni/W) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ni/W sputtering targets are commonly used in the production of thin film magnetic heads for hard disk drives (HDDs) and magneto-resistive random access memory (MRAM) devices. Ni/W sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity, making it a popular choice in many industries.
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Product Information
Nickel Tungsten (Ni/W) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ni/W sputtering targets are commonly used in the production of thin film magnetic heads for hard disk drives (HDDs) and magneto-resistive random access memory (MRAM) devices. Ni/W sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity, making it a popular choice in many industries.
Chemical Formula:Ni/W
CAS Number: 51890-28-9
Synonyms
Nickel-wolfram, NiW, WNi2, WNi3, NiW3, CAS 12384-50-8, CAS 12260-61-6, CAS 304021-50-9
Nickel Tungsten (Ni/W) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Compound Formula | WNi |
| Appearance | Metallic solid |
| Melting Point | 1500 °C |
| Boiling Point | N/A |
| Density | N/A |
| Solubility in H2O | N/A |
| Monoisotopic Mass | 241.886 g/mol |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Nickel Tungsten (Ni/W) Sputtering Target
Nickel Tungsten (Ni/W) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Nickel Tungsten (Ni/W) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Nickel Tungsten (Ni/W) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | W/Ni |
| MDL Number | N/A |
| EC No. | N/A |
| Pubchem CID | 13066886 |
| IUPAC Name | nickel; tungsten |
| SMILES | [Ni].[W] |
| InchI Identifier | InChI=1S/Ni.W |
| InchI Key | MOWMLACGTDMJRV-UHFFFAOYSA-N |
