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Nickel Vanadium (Ni/V) Sputtering Target

Product Code : ST-Ni/V-5N-Cu

Nickel Vanadium (Ni/V) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ni/V sputtering targets are commonly used in the production of thin-film magnetic heads for hard disk drives (HDDs) and giant magneto-resistive (GMR) sensors. Ni/V sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity, making it a popular choice in many industries. The addition of vanadium improves the corrosion resistance of the thin films produced, which is beneficial in many applications.


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Product Product Code Purity Size Contact Us
Nickel Vanadium (Ni/V) Sputtering Target ST-Ni/V-2N-Cu 99% Customize
Nickel Vanadium (Ni/V) Sputtering Target ST-Ni/V-3N-Cu 99.9% Customize
Nickel Vanadium (Ni/V) Sputtering Target ST-Ni/V-4N-Cu 99.99% Customize
Nickel Vanadium (Ni/V) Sputtering Target ST-Ni/V-5N-Cu 99.999% Customize

Product Information

Nickel Vanadium (Ni/V) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ni/V sputtering targets are commonly used in the production of thin-film magnetic heads for hard disk drives (HDDs) and giant magneto-resistive (GMR) sensors. Ni/V sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity, making it a popular choice in many industries. The addition of vanadium improves the corrosion resistance of the thin films produced, which is beneficial in many applications.


Chemical Formula:Ni/V
CAS Number: 685830-44-8


Synonyms

NiV, NiV7, nickel-vanadium, Ni93V7, Ni/V, 93/7 wt%, CAS 685830-44-8


Nickel Vanadium (Ni/V) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Properties(Theoretical)

Compound FormulaNiV
Molecular Weight109.63
AppearanceMetallic target
Melting Point1775-1875 °C
Boiling PointN/A
DensityN/A
Solubility in H2OInsoluble
Exact Mass108.879 g/mol
Monoisotopic Mass108.879 g/mol




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Nickel Vanadium (Ni/V) Sputtering Target

Nickel Vanadium (Ni/V) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Nickel Vanadium (Ni/V) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Nickel Vanadium (Ni/V) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifiers

Linear FormulaNi-V
MDL NumberMFCD01310520
EC No.N/A
Pubchem CID14299087
IUPAC Namenickel; vanadium
SMILES[V].[Ni]
InchI IdentifierInChI=1S/Ni.V
InchI KeyHBVFXTAPOLSOPB-UHFFFAOYSA-N




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