Product Code : ST-Pd-5N-Cu
Palladium (Pd) sputtering target is a material ideal for use in magnetic, lens, and coatings applications. It is also used as a sputtering target in vacuum deposition processes. Thanks to its superior electrical contact properties, palladium (Pd) can also be used for thin film metallization, plating, and semiconductor applications. It has a melting point of 1555°C (1830°F), and a relatively low vapor pressure. Palladium (Pd) sputtering targets can be typically found in a variety of sizes, including round, rectangular, boat, and ceramic targets. Its appearance is silver-white in color with a slightly shiny finish.
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Product Information
Palladium (Pd) sputtering target is a material ideal for use in magnetic, lens, and coatings applications. It is also used as a sputtering target in vacuum deposition processes. Thanks to its superior electrical contact properties, palladium (Pd) can also be used for thin film metallization, plating, and semiconductor applications. It has a melting point of 1555°C (1830°F), and a relatively low vapor pressure. Palladium (Pd) sputtering targets can be typically found in a variety of sizes, including round, rectangular, boat, and ceramic targets. Its appearance is silver-white in color with a slightly shiny finish.
Chemical Formula:Pd
CAS Number: 7440-05-3
Synonyms
N/A
Palladium (Pd) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Molecular Weight | 106.42 |
| Appearance | Gray Target |
| Melting Point | 1554 °C |
| Boiling Point | 2970 °C |
| Density | 12.02 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 10.54 microhm-cm @ 20°C |
| Electronegativity | 2.2 Paulings |
| Heat of Vaporization | 90 K-cal/gm atom at 2970°C |
| Poisson's Ratio | N/A |
| Specific Heat | 0.0584 Cal/g/K @ 25°C |
| Tensile Strength | N/A |
| Thermal Conductivity | 0.718 W/cm/K @ 298.2 K |
| Thermal Expansion | N/A |
| Vickers Hardness | N/A |
| Young's Modulus | N/A |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Palladium (Pd) Sputtering Target
Palladium (Pd) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Palladium (Pd) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Palladium (Pd) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Pd |
| MDL Number | MFCD00011167 |
| EC No. | 231-115-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23938 |
| SMILES | [Pd] |
| InchI Identifier | InChI=1S/Pd |
| InchI Key | KDLHZDBZIXYQEI-UHFFFAOYSA-N |
