Product Code : ST-Re-5N-Cu
Rhenium (Re) sputtering target refers to a flat plate or cylindrical shape made of pure rhenium metal or rhenium alloy used for the production of thin films by physical vapor deposition (PVD) technique called sputtering. The sputtering process is a widely used PVD method in the semiconductor, optics, and coatings industries.
Typically, the rhenium sputtering target is made from high-purity rhenium powder that is formed into a solid disc or cylinder. The shape and size of the target are designed to fit the sputtering chamber and the deposition requirement. The target is mounted onto a cathode and installed in the vacuum chamber. Under the influence of an electrical field, the target is bombarded by ions or atoms generated by a plasma source. As a result, the target material is sputtered off and deposited onto a substrate, forming a film with the same composition and properties as the target material.
Rhenium sputtering targets are commonly used for the deposition of thin films with excellent adhesion and durability as the metal has a high melting point, high resistivity, and good chemical stability. They are also used in the production of thermal evaporation sources or as a component of high-temperature alloys, heating elements, and electrical contacts.
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Product Information
Rhenium (Re) sputtering target refers to a flat plate or cylindrical shape made of pure rhenium metal or rhenium alloy used for the production of thin films by physical vapor deposition (PVD) technique called sputtering. The sputtering process is a widely used PVD method in the semiconductor, optics, and coatings industries.
Typically, the rhenium sputtering target is made from high-purity rhenium powder that is formed into a solid disc or cylinder. The shape and size of the target are designed to fit the sputtering chamber and the deposition requirement. The target is mounted onto a cathode and installed in the vacuum chamber. Under the influence of an electrical field, the target is bombarded by ions or atoms generated by a plasma source. As a result, the target material is sputtered off and deposited onto a substrate, forming a film with the same composition and properties as the target material.
Rhenium sputtering targets are commonly used for the deposition of thin films with excellent adhesion and durability as the metal has a high melting point, high resistivity, and good chemical stability. They are also used in the production of thermal evaporation sources or as a component of high-temperature alloys, heating elements, and electrical contacts.
Chemical Formula:Re
CAS Number: 7440-15-5
Synonyms
N/A
Rhenium (Re) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Molecular Weight | 186.21 |
| Appearance | Silvery-gray |
| Melting Point | 3180 °C |
| Boiling Point | 5627 °C |
| Density | 21.02 gm/cc |
| Solubility in H2O | N/A |
| Electrical Resistivity | 19.3 microhm-cm @ 20 °C |
| Electronegativity | 1.9 Paulings |
| Heat of Vaporization | 152 K-Cal/gm atom at 5627 °C |
| Poisson's Ratio | 0.3 |
| Specific Heat | 0.0329 Cal/g/K @ 25 °C |
| Tensile Strength | 80,000 psi |
| Thermal Conductivity | 0.480 W/cm/K @298.2 K |
| Thermal Expansion | 6.2 µm/(m·K) |
| Vickers Hardness | 2450 MPa |
| Young's Modulus | 463 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Rhenium (Re) Sputtering Target
Rhenium (Re) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Rhenium (Re) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Rhenium (Re) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Re |
| MDL Number | MFCD00011195 |
| EC No. | 231-124-5 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23947 |
| SMILES | [Re] |
| InchI Identifier | InChI=1S/Re |
| InchI Key | WUAPFZMCVAUBPE-UHFFFAOYSA-N |
