Product Code : ST-Rh-3N-Cu
Rhodium (Rh) sputtering target is a high-purity material that is used in a variety of thin film deposition applications. Rhodium is a precious metal that is known for its high corrosion resistance, high melting point, and excellent catalytic properties. Rhodium sputtering targets are used to deposit thin films of rhodium onto different substrates, including silicon, glass, and metals.
Rhodium sputtering targets are produced using a variety of methods, including powder metallurgy, hot pressing, and cold isostatic pressing. The sputtering targets are made with high purity rhodium and are often alloyed with other materials such as palladium, gold, or platinum to improve their properties. The sputtering target is designed to withstand the high temperatures and high-energy plasma of the sputtering process, ensuring a high-quality deposition.
Rhodium sputtering targets are used in a range of applications, including the production of semiconductor components, optical coatings, and biomedical devices. Rhodium thin films are also used in hard disk drives and as protective coatings in corrosive environments.
Rhodium sputtering targets are available in a variety of shapes and sizes, including round, rectangular, square, and custom shapes. The targets are also available in various thicknesses and purities to suit different applications. The purity of the rhodium sputtering target is an essential factor that affects the quality of the deposited films. High-purity rhodium sputtering targets can produce films with high adhesion, uniformity, and low defect density.
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Product Information
Rhodium (Rh) sputtering target is a high-purity material that is used in a variety of thin film deposition applications. Rhodium is a precious metal that is known for its high corrosion resistance, high melting point, and excellent catalytic properties. Rhodium sputtering targets are used to deposit thin films of rhodium onto different substrates, including silicon, glass, and metals.
Rhodium sputtering targets are produced using a variety of methods, including powder metallurgy, hot pressing, and cold isostatic pressing. The sputtering targets are made with high purity rhodium and are often alloyed with other materials such as palladium, gold, or platinum to improve their properties. The sputtering target is designed to withstand the high temperatures and high-energy plasma of the sputtering process, ensuring a high-quality deposition.
Rhodium sputtering targets are used in a range of applications, including the production of semiconductor components, optical coatings, and biomedical devices. Rhodium thin films are also used in hard disk drives and as protective coatings in corrosive environments.
Rhodium sputtering targets are available in a variety of shapes and sizes, including round, rectangular, square, and custom shapes. The targets are also available in various thicknesses and purities to suit different applications. The purity of the rhodium sputtering target is an essential factor that affects the quality of the deposited films. High-purity rhodium sputtering targets can produce films with high adhesion, uniformity, and low defect density.
Chemical Formula:Rh
CAS Number: 7440-16-6
Synonyms
N/A
Rhodium (Rh) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Molecular Weight | 102.91 |
| Appearance | Gray |
| Melting Point | 1966 °C |
| Boiling Point | 3727 °C |
| Density | 12.41 gm/cc |
| Solubility in H2O | N/A |
| Electrical Resistivity | 4.51 microhm-cm @ 20°C |
| Electronegativity | 2.2 Paulings |
| Heat of Vaporization | 127 K-Cal/gm atom at 3727°C |
| Poisson's Ratio | 0.26 |
| Specific Heat | 0.0583 Cal/g/K @ 25°C |
| Tensile Strength | N/A |
| Thermal Conductivity | 1.50 W/cm/K @ 298.2 K |
| Thermal Expansion | (25 °C) 8.2 µm·m-1·K-1 |
| Vickers Hardness | 1246 MPa |
| Young's Modulus | 380 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Rhodium (Rh) Sputtering Target
Rhodium (Rh) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Rhodium (Rh) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Rhodium (Rh) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Rh |
| MDL Number | MFCD00011201 |
| EC No. | 231-125-0 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23948 |
| SMILES | [Rh] |
| InchI Identifier | InChI=1S/Rh |
| InchI Key | MHOVAHRLVXNVSD-UHFFFAOYSA-N |
