Ruthenium (Ru) Sputtering Target

Product Information

Ruthenium (Ru) sputtering target is a material that is used in the production of thin films by the sputtering deposition process. Ruthenium is a rare and precious metal that is known for its high melting point, corrosion resistance, and excellent electrical conductivity. Ruthenium sputtering targets are manufactured using high-purity ruthenium and are used in a variety of applications, including semiconductor fabrication, solar cell production, and the production of hard disk drives.

Ruthenium sputtering targets are produced using a variety of methods, including powder metallurgy, hot pressing, and cold isostatic pressing. The sputtering targets are designed to withstand high temperatures and high-energy plasma, which are generated during the sputtering process. Ruthenium sputtering targets are often alloyed with other metals such as titanium, tungsten, and platinum to improve their properties. These materials are added to enhance the hardness, corrosion resistance, and adhesion of the deposited films.

Ruthenium sputtering targets are available in various shapes and sizes, including round, rectangular, square, and custom shapes. The targets are also available in different thicknesses and purities, depending on the specific application. High-purity ruthenium sputtering targets produce films with high uniformity, low defect density, and excellent adhesion. The purity of the ruthenium sputtering target is critical to ensure high-quality deposits and to avoid contamination of the films.

Ruthenium thin films have a wide range of applications, including the production of microelectronic components, optical coatings, and sensors. Ruthenium thin films are also used in the production of fuel cells, water splitting, and other electrochemical reactions. Additionally, ruthenium thin films are being developed for use in biomedical applications such as bio-electronic interfaces and drug delivery systems. The versatility of ruthenium sputtering targets makes them a valuable material in many high-tech industries.

Chemical Formula:Ru
CAS Number: 7440-18-8

Synonyms

N/A

Ruthenium (Ru) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size：

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Ruthenium (Ru) Sputtering Target

Ruthenium (Ru) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Packing of  Ruthenium (Ru) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Ruthenium (Ru)  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers