Product Code : ST-Ta/Al-5N-Cu
Tantalum Aluminum (Ta/Al) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ta/Al sputtering targets are commonly used in the production of thin films for electronic, optical, and decorative applications. The addition of tantalum (Ta) to aluminum (Al) improves the characteristics of the thin film produced such as adhesion to the substrate, corrosion resistance, and wear resistance. Ta/Al sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity. They are known for their high purity and are available in a range of sizes and specifications to meet the requirements of different applications.
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Product Information
Tantalum Aluminum (Ta/Al) sputtering target is a material used in the process of sputtering, which is a technique where atoms from the target material are ejected and deposited onto a substrate to form a thin film. Ta/Al sputtering targets are commonly used in the production of thin films for electronic, optical, and decorative applications. The addition of tantalum (Ta) to aluminum (Al) improves the characteristics of the thin film produced such as adhesion to the substrate, corrosion resistance, and wear resistance. Ta/Al sputtering targets have excellent thermal and mechanical stability, high sputtering rates, and good uniformity. They are known for their high purity and are available in a range of sizes and specifications to meet the requirements of different applications.
Chemical Formula:Ta/Al
Tantalum Aluminum (Ta/Al) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Tantalum Aluminum (Ta/Al) Sputtering Target
Tantalum Aluminum (Ta/Al) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Tantalum Aluminum (Ta/Al) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Tantalum Aluminum (Ta/Al) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
