Product Code : ST-TaC-5N-Cu
Tantalum Carbide (TaC) sputtering targets are solid-state compounds used as coating materials in the sputtering process. TaC is a ceramic material made up of tantalum and carbon atoms with a chemical formula of TaC.
Sputtering is a method of creating thin-film coatings by removing atoms from a solid source material and depositing them onto a substrate. Sputtering targets are generally made of high-purity materials that can be used to deposit thin films with high purity, uniformity, and consistency.
Tantalum Carbide sputtering targets are produced through powder metallurgy methods, wherein tantalum and carbon powders are combined and compressed into a solid compact. The compact is then sintered at high temperatures to form a dense, uniform, and high-purity target material.
Tantalum Carbide sputtering targets are widely used in the electronic and aerospace industries for coating materials on high-temperature turbine blades, cutting tools, and wear-resistant coatings on various components. They are also highly refractory and have excellent mechanical properties, making them well-suited for high-temperature and high-stress applications.
In conclusion, Tantalum Carbide sputtering targets are essential materials for thin-film deposition in various industries. Their unique properties, high purity, and uniformity make them ideal for coating applications requiring high-temperature and good wear resistance performance.
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Product Information
Tantalum Carbide (TaC) sputtering targets are solid-state compounds used as coating materials in the sputtering process. TaC is a ceramic material made up of tantalum and carbon atoms with a chemical formula of TaC.
Sputtering is a method of creating thin-film coatings by removing atoms from a solid source material and depositing them onto a substrate. Sputtering targets are generally made of high-purity materials that can be used to deposit thin films with high purity, uniformity, and consistency.
Tantalum Carbide sputtering targets are produced through powder metallurgy methods, wherein tantalum and carbon powders are combined and compressed into a solid compact. The compact is then sintered at high temperatures to form a dense, uniform, and high-purity target material.
Tantalum Carbide sputtering targets are widely used in the electronic and aerospace industries for coating materials on high-temperature turbine blades, cutting tools, and wear-resistant coatings on various components. They are also highly refractory and have excellent mechanical properties, making them well-suited for high-temperature and high-stress applications.
In conclusion, Tantalum Carbide sputtering targets are essential materials for thin-film deposition in various industries. Their unique properties, high purity, and uniformity make them ideal for coating applications requiring high-temperature and good wear resistance performance.
Chemical Formula: TaC
Synonyms
Tantalum(IV) carbide, methylidynetantalum
Tantalum Carbide (TaC) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Porperties（Theoretical）
| Compound Formula | TaC |
| Molecular Weight | 192.96 |
| Appearance | Brown to dark brown target |
| Melting Point | N/A |
| Boiling Point | N/A |
| Density | N/A |
| Solubility in H2O | N/A |
| Exact Mass | N/A |
| Monoisotopic Mass | N/A |
| Charge | N/A |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Tantalum Carbide (TaC) Sputtering Target
Tantalum Carbide (TaC) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Tantalum Carbide (TaC) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Tantalum Carbide (TaC) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifier
| Linear Formula | TaC |
| MDL Number | MFCD00011255 |
| EC No. | 235-118-3 |
| Pubchem CID | 46837398 |
| IUPAC Name | methanidylidynetantalum(1+) |
| SMILES | [C-]#[Ta+] |
| InchI Identifier | InChI=1S/C.Ta/q-1;+1 |
| InchI Key | DUMHRFXBHXIRTD-UHFFFAOYSA-N |
