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Tantalum Molybdenum (Ta/Mo) Sputtering Target

Product Code : ST-Ta/Mo-5N-Cu

A tantalum molybdenum (Ta/Mo) sputtering target is a material used in thin film deposition by sputtering, a process where the target material is bombarded with high-energy ions to eject atoms and form a thin film on a substrate.

Ta/Mo sputtering targets contain a mixture of tantalum and molybdenum, two refractory metals that exhibit high melting points, low evaporation rates, and excellent chemical and thermal stability. Tantalum enhances the corrosion resistance and ductility of the coating, while molybdenum improves its adherence, hardness, and wear resistance.

Ta/Mo sputtering targets are commonly used in the microelectronics and semiconductor industry for advanced applications such as interconnects, contacts, gates, diffusion barriers, and metallization layers. They can also be used in optical coatings, solar cells, and aerospace components. The targets are available in various shapes and sizes, including discs, rectangles, tubes, and custom configurations, depending on the specific requirements of the deposition process.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Tantalum Molybdenum (Ta/Mo) Sputtering Target ST-Ta/Mo-2N-Cu 99% Customize
Tantalum Molybdenum (Ta/Mo) Sputtering Target ST-Ta/Mo-3N-Cu 99.9% Customize
Tantalum Molybdenum (Ta/Mo) Sputtering Target ST-Ta/Mo-4N-Cu 99.99% Customize
Tantalum Molybdenum (Ta/Mo) Sputtering Target ST-Ta/Mo-5N-Cu 99.999% Customize

Product Information

A tantalum molybdenum (Ta/Mo) sputtering target is a material used in thin film deposition by sputtering, a process where the target material is bombarded with high-energy ions to eject atoms and form a thin film on a substrate.

Ta/Mo sputtering targets contain a mixture of tantalum and molybdenum, two refractory metals that exhibit high melting points, low evaporation rates, and excellent chemical and thermal stability. Tantalum enhances the corrosion resistance and ductility of the coating, while molybdenum improves its adherence, hardness, and wear resistance.

Ta/Mo sputtering targets are commonly used in the microelectronics and semiconductor industry for advanced applications such as interconnects, contacts, gates, diffusion barriers, and metallization layers. They can also be used in optical coatings, solar cells, and aerospace components. The targets are available in various shapes and sizes, including discs, rectangles, tubes, and custom configurations, depending on the specific requirements of the deposition process.

Chemical Formula:Ta/Mo
CAS Number:   146241-18-1

Synonyms

Tantalum moly, CAS 146241-18-1, Ta-Mo, TaMo, Ta/Mo – 20%/80%; 50%/50%


Tantalum Molybdenum (Ta/Mo)  Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Properties(Theoretical)

Compound FormulaMoTa
AppearanceMetallic target
Melting PointN/A
Boiling PointN/A
DensityN/A
Solubility in H2ON/A
Thermal Conductivity97 W/m·K
Thermal Expansion5.34 ppm/K
Monoisotopic Mass278.853 g/mol



Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Tantalum Molybdenum (Ta/Mo)  Sputtering Target

Tantalum Molybdenum (Ta/Mo)   Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Tantalum Molybdenum (Ta/Mo) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Tantalum Molybdenum (Ta/Mo)  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.



Chemical Identifiers

Linear FormulaMo-Ta
MDL NumberN/A
EC No.N/A
Pubchem CID71346017
IUPAC Namemolybdenum; tantalum
SMILES[Mo].[Ta]
InchI IdentifierInChI=1S/Mo.Ta
InchI KeyJZLMRQMUNCKZTP-UHFFFAOYSA-N




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