Tantalum Nitride (TaN) Sputtering Target

oduct Information

Tantalum nitride (TaN) sputtering targets are high-purity materials used in thin-film deposition processes. These targets are made of tantalum nitride, a compound that offers excellent electrical conductivity, thermal stability, and high melting point. TaN sputtering targets are used to deposit thin films of TaN on substrates such as silicon, glass, and metal.

TaN is widely used in various applications, including integrated circuit interconnects, gate electrodes, and thin-film resistors. It is also commonly used as a diffusion barrier material due to its good adherence to copper.

TaN sputtering targets can be fabricated using hot pressing, hot isostatic pressing, or cold isostatic pressing. The purity of the TaN target material can range from 99.9% up to 99.999%, with higher purity targets being more expensive. These targets are typically bonded to a copper or aluminum backing plate using indium.

Chemical Formula: TaN
CAS Number: 12033-62-4

Synonyms

Tantalum mononitride, Azanylidynetantalum, Nitridotantalum, Nitrilotantalum

Tantalum Nitride (TaN) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size：

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Tantalum Nitride (TaN) Sputtering Target

Tantalum Nitride (TaN)  Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Packing of Tantalum Nitride (TaN) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Tantalum Nitride (TaN) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers