Product Code : ST-Ta-5N-Cu
Tantalum sputtering target is used in integrated circuits and Thin Film Transistor Liquid Crystal Display (TFT-LCD). SAM specializes in producing high purity Sputtering Targets with the highest possible density and smallest possible average grain sizes.
Tantalum is a rare, hard, blue-gray, lustrous transition metal that is highly corrosion-resistant. It is part of the refractory metals group, which are widely used as minor components in alloys. The chemical inertness of tantalum makes it a valuable substance for laboratory equipment and a substitute for platinum.
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Product Information
Tantalum sputtering target is used in integrated circuits and Thin Film Transistor Liquid Crystal Display (TFT-LCD). SAM specializes in producing high purity Sputtering Targets with the highest possible density and smallest possible average grain sizes.
Tantalum is a rare, hard, blue-gray, lustrous transition metal that is highly corrosion-resistant. It is part of the refractory metals group, which are widely used as minor components in alloys. The chemical inertness of tantalum makes it a valuable substance for laboratory equipment and a substitute for platinum.
ATT provides high-quality Tantalum Sputtering Target for research and industry purposes at competitive prices. We can provide Tantalum Sputtering Target with different purity, size, and density according to your requirements.
Chemical Formula:Ta
CAS Number: 7440-25-7
Synonyms
Tantalum sputter target, 767514, 40894, 40896, 40897
Tantalum Sputtering Target Specification
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Purity: 99.95%, 99.99%, 99.999%
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Properties（Theoretical）
| Molecular Weight | 180.94 |
| Appearance | Silvery-gray solid |
| Melting Point | 3017 °C |
| Boiling Point | 5458 °C |
| Density | 16.69 g/cm3 (20 °C) |
| Solubility in H2O | N/A |
| Crystal Phase / Structure | α: body-centered cubic (bcc) / β: tetragonal |
| Electrical Resistivity | 131 nΩ·m (20 °C) |
| Electronegativity | 1.5 Paulings |
| Heat of Fusion | 36.57 kJ/mol |
| Heat of Vaporization | 753 kJ/mol |
| Poisson's Ratio | 0.34 |
| Specific Heat | 140 J/kg·K |
| Thermal Conductivity | 57.5 W/m·K |
| Thermal Expansion | 6.3 µm/m·K |
| Vickers Hardness | 870–1200 MPa |
| Young's Modulus | 186 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Tantalum Sputtering Target
High performance tantalum sputtering materials are used for thin film coating applications, CD-ROM, decoration, flat panel displays, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.
Capacitors
About half the tantalum consumed each year is used within the electronics industry, mainly as powder and wire for capacitors. The tantalum capacitor is favored in space-sensitive, high-end applications in telecommunications, data storage and implantable medical devices.
Semiconductors
Using the physical vapor deposition (PVD) process, the tantalum sputter target is “sputtered” onto semiconductor substrates to form a thin film diffusion barrier to protect the copper interconnects. Tantalum sputtering targets are used in a variety of other products, including magnetic storage media, inkjet printer heads and flat panel displays.
Engine turbine blades
The metal’s high melting point and resistance to corrosion makes it suitable for alloying applications. Tantalum is used in nickel based superalloys where the principal applications are turbine blades for aircraft engines and land based gas turbines.
Chemical processing equipment
Tantalum’s high resistance to corrosion and high temperature makes the metal an ideal material of construction for liners in vessels, piping, valves and heat exchangers in the chemical and pharmaceutical industries.
Packing of Tantalum Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Tantalum Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Ta |
| MDL Number | MFCD00011252 |
| EC No. | 231-135-5 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | N/A |
| SMILES | [Ta] |
| InchI Identifier | InChI=1S/Ta |
| InchI Key | GUVRBAGPIYLISA-UHFFFAOYSA-N |
