Product Code : ST-Te-5N-Cu
Tellurium (Te) sputtering target is a type of thin-film deposition material used in the fabrication of various electronic devices such as solar cells, thermoelectric generators, and memory devices. Sputtering targets are typically made from high-purity materials and are used to deposit thin films of the substrate material onto a substrate surface through a technique called sputtering.
Tellurium (Te) sputtering targets are made from high-purity tellurium metal and are utilized in a range of electronic applications. Tellurium is a brittle and highly toxic metalloid that displays semiconducting properties, which makes it important to use high-purity material from certified suppliers to reduce potential contamination in deposited films.
The manufacturing process of Tellurium (Te) sputtering target involves melting the high-purity tellurium metal in an induction furnace to create uniformity. This is followed by casting the molten material into a pre-defined shape such as a disc, and then finishing to a high degree of surface quality.
Tellurium (Te) sputtering targets vary in thickness and size based on the specific use and application. They are commonly used for the deposition of thin films through techniques such as radio frequency (RF) magnetron sputtering, direct current (DC) sputtering, and pulsed laser deposition (PLD) to create thin films of high purity tellurium, which is useful for electronic applications by virtue of its semiconducting properties. It is among the few known materials that exhibit good thermoelectric properties at room temperature, making it important for thermoelectric generator applications.
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Product Information
Tellurium (Te) sputtering target is a type of thin-film deposition material used in the fabrication of various electronic devices such as solar cells, thermoelectric generators, and memory devices. Sputtering targets are typically made from high-purity materials and are used to deposit thin films of the substrate material onto a substrate surface through a technique called sputtering.
Tellurium (Te) sputtering targets are made from high-purity tellurium metal and are utilized in a range of electronic applications. Tellurium is a brittle and highly toxic metalloid that displays semiconducting properties, which makes it important to use high-purity material from certified suppliers to reduce potential contamination in deposited films.
The manufacturing process of Tellurium (Te) sputtering target involves melting the high-purity tellurium metal in an induction furnace to create uniformity. This is followed by casting the molten material into a pre-defined shape such as a disc, and then finishing to a high degree of surface quality.
Tellurium (Te) sputtering targets vary in thickness and size based on the specific use and application. They are commonly used for the deposition of thin films through techniques such as radio frequency (RF) magnetron sputtering, direct current (DC) sputtering, and pulsed laser deposition (PLD) to create thin films of high purity tellurium, which is useful for electronic applications by virtue of its semiconducting properties. It is among the few known materials that exhibit good thermoelectric properties at room temperature, making it important for thermoelectric generator applications.
Chemical Formula:Te
CAS Number: 13494-80-9
Synonyms
N/A
Tellurium (Te) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Appearance | Solid |
| Melting Point | 449.51 °C |
| Boiling Point | 988 °C |
| Density | 6.24 g/cm3 (20 °C) |
| Solubility in H2O | N/A |
| Refractive Index | 1.000991 |
| Crystal Phase / Structure | Hexagonal |
| Electrical Resistivity | 436000 µΩ · cm (20 °C |
| Electronegativity | 2.1 Paulings |
| Heat of Fusion | 17.49 kJ/mol |
| Heat of Vaporization | 114.1 kJ/mol |
| Specific Heat | 0.20 J/g·K |
| Thermal Conductivity | 1.97-3.0 W/m·K |
| Thermal Expansion | 18 µm/m·K (20 °C) |
| Young's Modulus | 43 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Tellurium (Te) Sputtering Target
Tellurium (Te) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Tellurium (Te) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Tellurium (Te) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Te |
| MDL Number | MFCD00134062 |
| EC No. | 236-813-4 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 6327182 |
| SMILES | [Te] |
| InchI Identifier | InChI=1S/Te |
| InchI Key | PORWMNRCUJJQNO-UHFFFAOYSA-N |
