Product Code : ST-Tb-5N-Cu
Terbium sputtering targets are used in the production of thin-film devices such as magnetic storage media, flat-panel displays, and solar cells. Terbium sputtering targets are made by compressing Terbium powder into a solid disc and mounting it onto a target backing plate.
The sputtering process involves bombarding the target with high-energy ions, which knock atoms off the surface of the target and deposit them onto the substrate material. This creates a thin film of Terbium on the substrate, which can be used to enhance the properties of the device being produced.
Terbium sputtering targets are highly pure and have excellent uniformity and density. They are available in a range of sizes and configurations to suit different sputtering systems. Terbium sputtering targets are also available in custom sizes and shapes to meet specific customer requirements.
Terbium sputtering targets are made using advanced manufacturing techniques to ensure high quality and reliability. They are widely used in the semiconductor industry and other high-technology applications where thin-film deposition is required.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Terbium sputtering targets are used in the production of thin-film devices such as magnetic storage media, flat-panel displays, and solar cells. Terbium sputtering targets are made by compressing Terbium powder into a solid disc and mounting it onto a target backing plate.
The sputtering process involves bombarding the target with high-energy ions, which knock atoms off the surface of the target and deposit them onto the substrate material. This creates a thin film of Terbium on the substrate, which can be used to enhance the properties of the device being produced.
Terbium sputtering targets are highly pure and have excellent uniformity and density. They are available in a range of sizes and configurations to suit different sputtering systems. Terbium sputtering targets are also available in custom sizes and shapes to meet specific customer requirements.
Terbium sputtering targets are made using advanced manufacturing techniques to ensure high quality and reliability. They are widely used in the semiconductor industry and other high-technology applications where thin-film deposition is required.
Chemical Formula:Tb
CAS Number: 7440-27-9
Synonyms
Terbium sputter target, 45622, 45738, 45930, 46062
Terbium (Tb) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Molecular Weight | 158.93 |
| Appearance | Silvery |
| Melting Point | 1356 °C |
| Boiling Point | 3230 °C |
| Density | 8219 kg/m³ |
| Solubility in H2O | N/A |
| Electrical Resistivity | N/A |
| Electronegativity | 1.2 Paulings |
| Heat of Vaporization | 70 K-Cal/gm atom at 3123 °C |
| Poisson's Ratio | ( form) 0.261 |
| Specific Heat | 0.0437 Cal/g/K @ 25 °C |
| Tensile Strength | 60 MPa |
| Thermal Conductivity | 0.111 W/cm/K @ 298.2 K |
| Thermal Expansion | (r.t.) (poly) 10.3 µm/(m·K) |
| Vickers Hardness | 863 MPa |
| Young's Modulus | ( form) 55.7 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Terbium (Tb) Sputtering Target
Terbium (Tb) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Terbium (Tb) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Terbium (Tb) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Tb |
| MDL Number | MFCD00011256 |
| EC No. | 231-137-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23958 |
| SMILES | [Tb] |
| InchI Identifier | InChI=1S/Tb |
| InchI Key | GZCRRIHWUXGPOV-UHFFFAOYSA-N |
