Product Code : ST-Tm-5N-Cu
Thulium (Tm) sputtering targets are used in physical vapor deposition (PVD) processes to deposit thin films of thulium onto a substrate. Thulium is a rare earth metal with atomic number 69 and symbol Tm. It has a silver-gray appearance and is relatively soft and ductile. Thulium has a unique magnetic property known as anomalous Hall effect, and it is used in various applications such as lasers, nuclear medicine, and magnetic storage media.
Thulium sputtering targets are made by compressing and sintering thulium powder into a dense, homogeneous slab. The sputtering target is then machined to the desired size and flatness and mounted onto a backing plate. During the sputtering process, thulium atoms are ejected from the target by positive ions and are deposited onto a substrate to form a thin film. Thulium sputtering targets are typically used in a high vacuum environment, such as a sputtering chamber, and require careful handling and storage to prevent damage or contamination.
Thulium sputtering targets are ideal for depositing thulium films with high purity, uniformity, and adhesion. Thulium films have various applications, including magnetic sensors, optical filters, and radiation detectors. Thulium sputtering targets are also used in research and development for investigating the magnetic and electronic properties of thulium-based materials.
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Product Information
Thulium (Tm) sputtering targets are used in physical vapor deposition (PVD) processes to deposit thin films of thulium onto a substrate. Thulium is a rare earth metal with atomic number 69 and symbol Tm. It has a silver-gray appearance and is relatively soft and ductile. Thulium has a unique magnetic property known as anomalous Hall effect, and it is used in various applications such as lasers, nuclear medicine, and magnetic storage media.
Thulium sputtering targets are made by compressing and sintering thulium powder into a dense, homogeneous slab. The sputtering target is then machined to the desired size and flatness and mounted onto a backing plate. During the sputtering process, thulium atoms are ejected from the target by positive ions and are deposited onto a substrate to form a thin film. Thulium sputtering targets are typically used in a high vacuum environment, such as a sputtering chamber, and require careful handling and storage to prevent damage or contamination.
Thulium sputtering targets are ideal for depositing thulium films with high purity, uniformity, and adhesion. Thulium films have various applications, including magnetic sensors, optical filters, and radiation detectors. Thulium sputtering targets are also used in research and development for investigating the magnetic and electronic properties of thulium-based materials.
Chemical Formula:Tm
CAS Number: 7440-30-4
Synonyms
Terbium sputter target, 45622, 45738, 45930, 46062
Thulium (Tm) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Molecular Weight | 168.93 |
| Appearance | Silvery |
| Melting Point | 1545 °C |
| Boiling Point | 1950 °C |
| Density | 9321 kg/m3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 79.0 microhm-cm @ 25°C |
| Electronegativity | 1.2 Paulings |
| Heat of Vaporization | 59 K-Cal/gm atom at 1947°C |
| Poisson's Ratio | 0.213 |
| Specific Heat | 0.0382 Cal/g/K @ 25 °C |
| Tensile Strength | 60 MPa |
| Thermal Conductivity | 0.169 W/cm/K @ 298.2 K |
| Thermal Expansion | (r.t.) (poly) 13.3 µm/(m·K) |
| Vickers Hardness | 520 MPa |
| Young's Modulus | 74.0 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Thulium (Tm) Sputtering Target
Terbium (Tb) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Thulium (Tm) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Thulium (Tm) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Tm |
| MDL Number | MFCD00011281 |
| EC No. | 231-140-2 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23961 |
| SMILES | [Tm] |
| InchI Identifier | InChI=1S/Tm |
| InchI Key | FRNOGLGSGLTDKL-UHFFFAOYSA-N |
