Product Code : ST-Sn-5N-Cu
The tin sputtering target is a silvery lustrous gray metallic sputtering target composed of high purity tin metal. Tin, also called stannum, is a chemical element that originated from the Anglo-Saxon word tin (stannum in Latin, meaning hard). It was early used in 3500 BC. “Sn” is the canonical chemical symbol of tin. Its atomic number in the periodic table of elements is 50 with a location at Period 5 and Group 14, belonging to the p-block. The relative atomic mass of tin is 118.710(7) Dalton, the number in the brackets indicating the uncertainty.
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Product Information
The tin sputtering target is a silvery lustrous gray metallic sputtering target composed of high purity tin metal. Tin, also called stannum, is a chemical element that originated from the Anglo-Saxon word tin (stannum in Latin, meaning hard). It was early used in 3500 BC. “Sn” is the canonical chemical symbol of tin. Its atomic number in the periodic table of elements is 50 with a location at Period 5 and Group 14, belonging to the p-block. The relative atomic mass of tin is 118.710(7) Dalton, the number in the brackets indicating the uncertainty.
ATT provides high-quality Tin Sputtering Target for research and industry purposes at competitive prices. We can provide Tin Sputtering Target with different purity, size, and density according to your requirements.
Chemical Formula: Sn
CAS Number: 7440-31-5
Synonyms
Tin sputter target, 40898, 40899, 40901
Tin Sputtering Target Specification
Size:
Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
Thickness | 0.125”, 0.25” |
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Properties(Theoretical)
Molecular Weight | 118.69 |
Appearance | Silver-gray metallic solid |
Melting Point | 232 °C |
Boiling Point | 2602 °C |
Density | 7.265-7.31 g/cm3 (20 °C) |
Solubility in H2O | N/A |
Electrical Resistivity | 11.5 x 10-8 Ω·m |
Electronegativity | 1.96 Paulings |
Heat of Fusion | 7.03 kJ/mol |
Heat of Vaporization | 296.1 kJ/mol |
Poisson's Ratio | 0.36 |
Specific Heat | 0.21 J/g·°C (25 °C) |
Thermal Conductivity | 66.8 W/(m·K) |
Thermal Expansion | 22.0 µm/(m·K) (20 °C) |
Young's Modulus | 50 GPa |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Tin Sputtering Target
Tin sputtering targets are used for thin film deposition, typically for fuel cell, decoration, semiconductor, display, LED and photovoltaic devices, glass coating, etc. Tin is also used to coat other metals to prevent corrosion. Tin alloys are important in soft solder, pewter, bronze and phosphor bronze. For instance, the niobium-tin alloy is used for superconducting magnets.
packing of Tin Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Tin Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Sn |
MDL Number | MFCD00133862 |
EC No. | 231-141-8 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | N/A |
SMILES | [Sn] |
InchI Identifier | InChI=1S/Sn |
InchI Key | ATJFFYVFTNAWJD-UHFFFAOYSA-N |