Titanium Aluminum Sputtering Target, Ti/Al

Product Information

Titanium aluminum sputtering target from ATT is a silvery alloy sputtering material containing Ti and Al.

Titanium is a chemical element originated from Titans, the sons of the Earth goddess of Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation was later accomplished and announced by J. Berzelius. “Ti” is the canonical chemical symbol of titanium. Its atomic number in the periodic table of elements is 22 with location at Period 4 and Group 4, belonging to the d-block. The relative atomic mass of titanium is 47.867(1) Dalton, the number in the brackets indicating the uncertainty.

Aluminium, also called aluminum, is a chemical element originated from the Latin name for alum, ‘alumen’ meaningbitter salt. It was first mentioned in 1825 and observed by H.C.Ørsted. The isolation was later accomplished and announced by H.C.Ørsted. “Al” is the canonical chemical symbol of aluminium. Its atomic number in the periodic table of elements is 13 with location at Period 3 and Group 13, belonging to the p-block. The relative atomic mass of aluminium is 26.9815386(8) Dalton, the number in the brackets indicating the uncertainty.

ATT provides high-quality Titanium aluminum Sputtering Target for research and industry purposes at competitive prices. We can provide  Titanium aluminum Sputtering Target with different purity, size, and density according to your requirements.

Chemical Formula: Ti/Al

CAS Number: 12004-78-3

Synonyms

N/A

Titanium Aluminum Sputtering Target Specification

Size：

Purity: 99.9%, 99.95%, 99.99%

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of  Titanium Aluminum Sputtering Target

The titanium aluminum sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Packing of Titanium Aluminum Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Titanium Aluminum  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers