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Titanium Carbide (TiC) Sputtering Target

Product Code : ST-TiC-5N-Cu

Titanium Carbide (TiC) sputtering targets are solid-state compounds used to coat surfaces via sputtering. TiC is a ceramic compound made from titanium and carbon atoms, with a chemical formula of TiC.

Titanium Carbide sputtering targets are used to deposit thin films on various substrates, such as ceramics, metals, and plastics. Sputtering is a physical vapor deposition technique that involves bombarding a target material with high-energy ions to release atoms that can then deposit onto a substrate to form a thin film.

The production of Titanium Carbide sputtering targets involves powder metallurgy processes, where TiC powders are consolidated into a solid material and then shaped into the desired target form, which may include rectangular, circular, or tubular shapes. The target is then subjected to a thorough cleaning process before being placed into a sputtering chamber for use.

Titanium Carbide sputtering targets are used in a wide array of applications due to their excellent mechanical and chemical properties, high temperature stability, and electrical conductivity. They are commonly used in the aerospace and defense industries for coating on aircraft parts, turbine blades, and rocket nozzles. Additionally, Titanium Carbide sputtering targets possess high corrosion resistance, making them ideal for applications involving exposure to harsh environments.

In conclusion, Titanium Carbide sputtering targets are crucial for various applications requiring high-coating quality. Their excellent mechanical and chemical properties and high-temperature stability make them well-suited for use in the aerospace, defense, and energy industries.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Titanium Carbide (TiC) Sputtering Target ST-TiC-2N-Cu 99% Customize
Titanium Carbide (TiC) Sputtering Target ST-TiC-3N-Cu 99.9% Customize
Titanium Carbide (TiC) Sputtering Target ST-TiC-4N-Cu 99.99% Customize
Titanium Carbide (TiC) Sputtering Target ST-TiC-5N-Cu 99.999% Customize

Product Information

Titanium Carbide (TiC) sputtering targets are solid-state compounds used to coat surfaces via sputtering. TiC is a ceramic compound made from titanium and carbon atoms, with a chemical formula of TiC.

Titanium Carbide sputtering targets are used to deposit thin films on various substrates, such as ceramics, metals, and plastics. Sputtering is a physical vapor deposition technique that involves bombarding a target material with high-energy ions to release atoms that can then deposit onto a substrate to form a thin film.

The production of Titanium Carbide sputtering targets involves powder metallurgy processes, where TiC powders are consolidated into a solid material and then shaped into the desired target form, which may include rectangular, circular, or tubular shapes. The target is then subjected to a thorough cleaning process before being placed into a sputtering chamber for use.

Titanium Carbide sputtering targets are used in a wide array of applications due to their excellent mechanical and chemical properties, high temperature stability, and electrical conductivity. They are commonly used in the aerospace and defense industries for coating on aircraft parts, turbine blades, and rocket nozzles. Additionally, Titanium Carbide sputtering targets possess high corrosion resistance, making them ideal for applications involving exposure to harsh environments.

In conclusion, Titanium Carbide sputtering targets are crucial for various applications requiring high-coating quality. Their excellent mechanical and chemical properties and high-temperature stability make them well-suited for use in the aerospace, defense, and energy industries.


Chemical Formula: TiC

CAS Number:    12070-08-5



Titanium Carbide (TiC) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Porperties(Theoretical)

Compound FormulaN/A
Molecular Weight59.89
Appearancesolid
Melting Point3160 °C, 3433 K,   5720 °F
Boiling Point4820 °C, 5093 K,   8708 °F
Density4.93 g/cm3
Solubility in H2ON/A
Exact MassN/A
Monoisotopic Mass63.979248 Da
ChargeN/A




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Titanium Carbide (TiC) Sputtering Target

Titanium Carbide (TiC) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Titanium Carbide (TiC) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Titanium Carbide (TiC) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifier

Linear FormulaTiC
MDL NumberMFCD00011268
EC No.235-120-4
Beilstein/Reaxys No.N/A
Pubchem CIDN/A
IUPAC NameN/A
SMILES[Ti].C
InchI IdentifierInChI=1S/CH4.Ti/h1H4;
InchI KeyTXKRDMUDKYVBLB-UHFFFAOYSA-N




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