Titanium Nitride Sputtering Target, TiN

Product Information

Titanium nitride sputtering target from ATT is a ceramic sputtering material containing Ti and N. Titanium nitride is an extremely hard ceramic material, often used as a coating on titanium alloys, steel, carbide, and aluminum components to improve the substrate’s surface properties.

Titanium is a chemical element originated from Titans, the sons of the Earth goddess of Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation was later accomplished and announced by J. Berzelius. “Ti” is the canonical chemical symbol of titanium. Its atomic number in the periodic table of elements is 22 with a location at Period 4 and Group 4, belonging to the d-block. The relative atomic mass of titanium is 47.867(1) Dalton, the number in the brackets indicating the uncertainty.

Nitrogen is a chemical element that originated from the Greek ‘nitron’ and ‘genes’ meaning nitre-forming. It was first mentioned in 1772 and observed by D. Rutherford. The isolation was later accomplished and announced by D. Rutherford. “N” is the canonical chemical symbol of nitrogen. Its atomic number in the periodic table of elements is 7 with a location at Period 2 and Group 15, belonging to the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, the number in the brackets indicating the uncertainty.

ATT provides high-quality Titanium Nitride  Sputtering Target for research and industry purposes at competitive prices. We can provide Titanium Nitride  Sputtering Target with different purity, size, and density according to your requirements.

Chemical Formula: TiN
CAS Number: 25583-20-4

Synonyms

N/A

Titanium Nitride Sputtering Target Specification

Size：

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Properties（Theoretical）

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Application of Titanium Nitride Sputtering Target

1. Titanium nitride sputtering targets are used to make TiN films. The tiN coating can be used on machine tools (such as drills and milling cutters) to maintain the edges and have corrosion resistance, usually increasing its service life by more than three times.

2. Because of TiN’s metallic gold color, it is used to coat costume jewelry and automotive trim for decorative purposes.

3. Thin films of TiN are also used in microelectronics , where they serve as a conductive connection between the active device and the metal contacts used to operate the circuit, while acting as a diffusion barrier to block the diffusion of the metal into the silicon.

4. TiN films can also be used as electrodes in bioelectronic applications, such as smart implants or in vivo biosensors that must withstand severe corrosion caused by body fluids.

Packing of  Titanium Nitride  Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Titanium Nitride  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers