Product Code : ST-V/W-5N-Cu
Vanadium tungsten sputtering target is a type of thin film deposition material that consists of vanadium and tungsten metals. It is used in the physical vapor deposition (PVD) process for creating thin films on a range of substrates. The sputtering process involves the use of a sputtering gun to discharge and accelerate high-energy ions towards the target material. This bombardment causes atoms to be ejected from the target and deposited onto the substrate.
The vanadium tungsten sputtering target is manufactured by melting and casting high-purity vanadium and tungsten metals into a specific shape and size. The target then goes through a series of processes to ensure purity and quality, ultimately meeting the required specifications for the intended application.
The target material is particularly suited for producing films with unique properties, including high wear-resistance, high-temperature resistance, and excellent electrical conductivity. Therefore, it is commonly used in high-performance coatings in the semiconductor, solar cell, and thin-film battery industries. Additionally, it is also used in aerospace, automotive, and optics applications owing to its high mechanical strength and excellent corrosion resistance.
Vanadium tungsten sputtering target is available in a wide range of sizes and shapes tailored to fit specific applications. Therefore, it is a crucial material for the PVD process, where it is used to create robust and durable coatings with unique properties that offer extended product lifetimes and improved performance.
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Product Information
Vanadium tungsten sputtering target is a type of thin film deposition material that consists of vanadium and tungsten metals. It is used in the physical vapor deposition (PVD) process for creating thin films on a range of substrates. The sputtering process involves the use of a sputtering gun to discharge and accelerate high-energy ions towards the target material. This bombardment causes atoms to be ejected from the target and deposited onto the substrate.
The vanadium tungsten sputtering target is manufactured by melting and casting high-purity vanadium and tungsten metals into a specific shape and size. The target then goes through a series of processes to ensure purity and quality, ultimately meeting the required specifications for the intended application.
The target material is particularly suited for producing films with unique properties, including high wear-resistance, high-temperature resistance, and excellent electrical conductivity. Therefore, it is commonly used in high-performance coatings in the semiconductor, solar cell, and thin-film battery industries. Additionally, it is also used in aerospace, automotive, and optics applications owing to its high mechanical strength and excellent corrosion resistance.
Vanadium tungsten sputtering target is available in a wide range of sizes and shapes tailored to fit specific applications. Therefore, it is a crucial material for the PVD process, where it is used to create robust and durable coatings with unique properties that offer extended product lifetimes and improved performance.
Chemical Formula:V/W
Vanadium Tungsten (V/W) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Properties（Theoretical）
| Compound Formula | V-W |
| Appearance | Metallic target |
| Melting Point | N/A |
| Boiling Point | N/A |
| Density | N/A |
| Solubility in H2O | N/A |
| Monoisotopic Mass | 234.89489 g/mol |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Vanadium Tungsten (V/W) Sputtering Target
Vanadium Tungsten (V/W) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Vanadium Tungsten (V/W) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Vanadium Tungsten (V/W) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | V-W |
| MDL Number | N/A |
| EC No. | N/A |
| Pubchem CID | 20728186 |
| IUPAC Name | tungsten; vanadium |
| SMILES | [V].[W] |
| InchI Identifier | InChI=1S/V.W |
| InchI Key | NWJUARNXABNMDW-UHFFFAOYSA-N |
