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Zinc Aluminum (Zn/Al) Sputtering Target

Product Code : ST-Zn/Al-5N-Cu

Zinc aluminum sputtering target refers to a thin film deposition material that contains both zinc and aluminum metals. It is used in the physical vapor deposition (PVD) process, where a sputtering gun discharges high-energy ions onto the target material to create a thin film on the substrate.

The Zn/Al sputtering target is produced by melting and casting high-purity zinc and aluminum metals. The target material is made to meet the specific shape and size requirements for different applications. Furthermore, it undergoes rigorous testing and quality checks to ensure it meets the required specifications for the intended application.

Zinc aluminum sputtering targets are widely used in the manufacturing of thin films for the solar cell, semiconductor, and flat-panel display industries. The material provides unique properties such as excellent wear-resistance, scratch-resistance, and corrosion resistance, making it an ideal material for creating protective coatings on various substrates.

Zinc aluminum sputtering target is available in various sizes and shapes, depending on the specific application requirements. It is a critical material in the PVD process for producing high-quality, durable, and advanced thin films with unique properties that meet the increasingly demanding manufacturing needs of various industries.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Zinc Aluminum (Zn/Al) Sputtering Target ST-Zn/Al-2N-Cu 99% Customize
Zinc Aluminum (Zn/Al) Sputtering Target ST-Zn/Al-3N-Cu 99.9% Customize
Zinc Aluminum (Zn/Al) Sputtering Target ST-Zn/Al-4N-Cu 99.99% Customize
Zinc Aluminum (Zn/Al) Sputtering Target ST-Zn/Al-5N-Cu 99.999% Customize

Product Information

Zinc aluminum sputtering target refers to a thin film deposition material that contains both zinc and aluminum metals. It is used in the physical vapor deposition (PVD) process, where a sputtering gun discharges high-energy ions onto the target material to create a thin film on the substrate.

The Zn/Al sputtering target is produced by melting and casting high-purity zinc and aluminum metals. The target material is made to meet the specific shape and size requirements for different applications. Furthermore, it undergoes rigorous testing and quality checks to ensure it meets the required specifications for the intended application.

Zinc aluminum sputtering targets are widely used in the manufacturing of thin films for the solar cell, semiconductor, and flat-panel display industries. The material provides unique properties such as excellent wear-resistance, scratch-resistance, and corrosion resistance, making it an ideal material for creating protective coatings on various substrates.

Zinc aluminum sputtering target is available in various sizes and shapes, depending on the specific application requirements. It is a critical material in the PVD process for producing high-quality, durable, and advanced thin films with unique properties that meet the increasingly demanding manufacturing needs of various industries.

Chemical Formula:Al/Mg


Synonyms

Zamak 2 (ASTM AC43A, Z35541, Mazak 2), Zamak 5 (ASTM AC41A, Z35531, Mazak 5)


Zinc Aluminum (Zn/Al) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”


Properties(Theoretical)

AppearanceTarget
Melting Point380 °C (720 °F)
Boiling PointN/A
Density7.0 g/cm3
Solubility in H2ON/A
Electrical Resistivity-7 10x Ω-m
Poisson's Ratio0.25
Specific Heat420 J/kg-K
Tensile Strength280 MPa (Ultimate)/ 220 MPa (Yield)
Thermal Conductivity110 W/m-K
Thermal Expansion27 µm/m-K
Young's Modulus98 GPa




Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Zinc Aluminum (Zn/Al)  Sputtering Target

Zinc Aluminum (Zn/Al)  Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of Zinc Aluminum (Zn/Al) Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs Zinc Aluminum (Zn/Al)   Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


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