Product Code : ST-Zn/Cu-5N-Cu
Zinc-copper sputtering target refers to a thin film deposition material containing both zinc and copper metals. It is used in the physical vapor deposition (PVD) process to produce thin films on various substrates through the application of high-energy ions using a sputtering gun.
The Zn/Cu sputtering target is made through a process of melting and casting high-purity zinc and copper metals into a specific shape and size. The target goes through a series of processes to remove any impurities and ensure it meets the required specifications for the intended application.
The target material is ideal in the semiconductor, flat-panel display, and solar cell industries, where it possesses unique properties such as high thermal conductivity, good electrical conductivity and corrosion resistance. It is also used in automotive, aerospace, and decorative coating applications. The Zn/Cu sputtering target can be used to produce coatings with unique properties, including highly corrosion-resistant, highly conductive, and good adhesion.
Zinc-copper sputtering targets are available in various sizes and shapes, depending on the specific application requirements. The use of this target material is steadily increasing due to the growing demand for advanced materials, improved product quality, and durability.
Overall, Zinc-copper sputtering target is a crucial material in the PVD process for producing robust and durable thin films with unique properties to meet the increasingly demanding manufacturing needs in various industries.
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Product Information
Zinc-copper sputtering target refers to a thin film deposition material containing both zinc and copper metals. It is used in the physical vapor deposition (PVD) process to produce thin films on various substrates through the application of high-energy ions using a sputtering gun.
The Zn/Cu sputtering target is made through a process of melting and casting high-purity zinc and copper metals into a specific shape and size. The target goes through a series of processes to remove any impurities and ensure it meets the required specifications for the intended application.
The target material is ideal in the semiconductor, flat-panel display, and solar cell industries, where it possesses unique properties such as high thermal conductivity, good electrical conductivity and corrosion resistance. It is also used in automotive, aerospace, and decorative coating applications. The Zn/Cu sputtering target can be used to produce coatings with unique properties, including highly corrosion-resistant, highly conductive, and good adhesion.
Zinc-copper sputtering targets are available in various sizes and shapes, depending on the specific application requirements. The use of this target material is steadily increasing due to the growing demand for advanced materials, improved product quality, and durability.
Overall, Zinc-copper sputtering target is a crucial material in the PVD process for producing robust and durable thin films with unique properties to meet the increasingly demanding manufacturing needs in various industries.
Chemical Formula:Zn/Cu
Zinc Copper (Zn/Cu) Sputtering Target Specification
Shape: Disc/Rectangular/Tube
Bonding: Unbonding/Bonding
Per your request or drawing
We can customized as required
Size：
| Circular Sputtering Targets | Diameter | 1.0”2.0”3.0”4.0”5.0”6.0”up to 21” |
| Rectangular Sputtering Targets | Width x Length | 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20” |
| Thickness | 0.125”, 0.25” | |
Sputtering Targets Requirements
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Application of Zinc Copper (Zn/Cu) Sputtering Target
Zinc Copper (Zn/Cu) Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packing of Zinc Copper (Zn/Cu) Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs Zinc Copper (Zn/Cu) Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
