Product Code : ME-Ti-5N-ST
ATT specializes in producing high-purity thallium phosphide sputtering targets with the highest density and smallest average grain size for semiconductor, chemical Vapor deposition (CVD) and physical vapor deposition (PVD) displays and optical applications. Our standard sputtering targets for thin films are available in single or combined flat target sizes and configurations up to 820 mm, with drill positions and threads, bevels, grooves and backings, designed for use with older sputtering equipment as well as the latest process equipment, such as large area coatings for solar or fuel cell and flip-chip applications. Research sizes are also targeted for production as well as custom sizes and alloys. All targets were analyzed using best-in-class demonstration techniques, including X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS), and inductively coupled plasma (ICP). "Sputtering" allows deposition of an ultra-high purity thin film of sputtered metal or oxide material onto another solid substrate, controlled removal of the target material by ion bombardment and conversion into a directed gas/plasma phase. Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. ATT also casts any rare earth metal and most other advanced materials into the form of rods, rods or plates, as well as other mechanical shapes.
ATT is a professional supplier of thallium sputtering targets, and we also manufacture plates, balls, ingots, balls, sheets, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
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Product Information
ATT specializes in producing high-purity thallium phosphide sputtering targets with the highest density and smallest average grain size for semiconductor, chemical Vapor deposition (CVD) and physical vapor deposition (PVD) displays and optical applications. Our standard sputtering targets for thin films are available in single or combined flat target sizes and configurations up to 820 mm, with drill positions and threads, bevels, grooves and backings, designed for use with older sputtering equipment as well as the latest process equipment, such as large area coatings for solar or fuel cell and flip-chip applications. Research sizes are also targeted for production as well as custom sizes and alloys. All targets were analyzed using best-in-class demonstration techniques, including X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS), and inductively coupled plasma (ICP). "Sputtering" allows deposition of an ultra-high purity thin film of sputtered metal or oxide material onto another solid substrate, controlled removal of the target material by ion bombardment and conversion into a directed gas/plasma phase. Materials are produced by ultra-high purification processes such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. ATT also casts any rare earth metal and most other advanced materials into the form of rods, rods or plates, as well as other mechanical shapes.
ATT is a professional supplier of thallium sputtering targets, and we also manufacture plates, balls, ingots, balls, sheets, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.
Synonyms
Thallium Sputtering Target Properties (Theoretical)
Molecular Weight | 204.37 |
Appearance | White Crystals |
Melting Point | 303.5 °C |
Boiling Point | 1457 °C |
Density | 11.85 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 18.0 microhm-cm @ 0 °C |
Electronegativity | 1.8 Paulings |
Heat of Vaporization | 38.8 K-Cal/gm atom at 1457°C |
Specific Heat | 0.0307 Cal/g/K @ 25°C |
Tensile Strength | N/A |
Thermal Conductivity | 0.461 W/cm/K @ 298.2 K |
Applications of Thallium Sputtering Target
Most thallium is used by the electronics industry in photoelectric cells. Thallium oxide is used to produce special glass with a high index of refraction, and also low melting glass that becomes fluid at about 125K. An alloy of mercury containing 8% thallium has a melting point 20°C lower than mercury alone.
Packing of Thallium Sputtering Target
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Thallium Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
Linear Formula | Tl |
MDL Number | MFCD00134063 |
EC No. | 231-138-1 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 5359464 |
SMILES | [Tl] |
InchI Identifier | InChI=1S/Tl |
InchI Key | BKVIYDNLLOSFOA-UHFFFAOYSA-N |