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High Purity Tin Metal (Sn Metal), Tin Ingot(Sn Ingot)

Product Code : ME-Sn-7N-CU

Tin is a silvery-white, lustrous, malleable and pliable metal. It has a low melting temperature of about 232 °C (450 °F), and 177.3 °C (351.1 °F) for 11-nm particles. Tin is protected by an oxide film and resists corrosion and oxidation from water. A common alchemical symbol for tin is shown here embossed on a ‘tin’ can. Tin cans are traditionally made from steel coated with tin. A soft, pliable metal. Below 13°C it slowly changes to a powder form.

ATT is a professional supplier of high-purity Tin metals,The purity levels are 3N5, 4N, 4N5,5N,6N,7N.

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Tin IngotME-Sn-2N-CU99%Customized
Tin IngotME-Sn-4N-CU99.99%Customized
Tin IngotME-Sn-6N-CU99.9999%Customized
Tin IngotME-Sn-7N-CU99.99999%Customized
Tin IngotME-Sn-NN-CUCustomizedCustomized

Product Information

Tin is a silvery-white, lustrous, malleable and pliable metal. It has a low melting temperature of about 232 °C (450 °F), and 177.3 °C (351.1 °F) for 11-nm particles. Tin is protected by an oxide film and resists corrosion and oxidation from water. A common alchemical symbol for tin is shown here embossed on a ‘tin’ can. Tin cans are traditionally made from steel coated with tin. A soft, pliable metal. Below 13°C it slowly changes to a powder form.


ATT is a professional supplier of high-purity Tin metals,The purity levels are 3N5, 4N, 4N5,5N,6N,7N. ATT manufactures ultra high purity tin metal in various forms for advanced thin film deposition technologies such as PVD, MBE, E-beam, and vacuum deposition. High purity tin metal is used to produce transparent conductive oxide (TCO) glasses such as indium tin oxide (ITO) and compound semiconductors such as tin selenide. High purity tin is also suitable as an alloy additive for electronic solders or a reference material for impurity analysis. Forms include evaporation pieces, granules, and others. Tin can be combined with various elements to form a wide variety of useful alloys. Tin is frequently alloyed with copper. Pewter, another frequently used Tin alloy, is 85–99% tin and 1-15% copper, antimony, bismuth and lead. Tin is also a constituent of bronzes, pewter, certain bearing materials and fusible alloys.


Synonyms

Vacuum deposition grade tin, Semiconductor, optical, and electronics grade tin, Semiconductor, optical, and electronics grade tin, MBE grade tin

Tin Ingot Specification

Size:customized

Purity:2N(99%), 3N5(99.95%), 4N(99.99%), 4N5(99.995%),5N(99.999%),6N(99.9999%),7N(99.99999%).

Per your request or drawing

We can customized as required


Properties(Theoretical)

Molecular Weight
118.69
Appearance
Silvery-gray metallic solid
Electrical   resistivity ( µOhmcm )12.6@20°C
Superconductivity   critical temperature ( K )3.7220
Temperature   coefficient ( K¹ )0.00460   @0-100°C
Thermal emf   against Pt (cold 0C - hot 100C) ( mV )0.42
Bulk modulus (   GPa ) ( Polycrystalline )58.2
Hardness -   Mohs ( Polycrystalline )1.50 - 1.80
Material   conditionPolycrystalline
Poisson's   ratio ( Polycrystalline )0.357
Tensile   modulus ( GPa ) ( Polycrystalline )49.90
Boiling point   ( C )2270
Density ( g cm⁻³ )7.280 @20°C
Coefficient of   thermal expansion ( x10⁻⁶ K⁻¹ )23.500   @0-100°C
Latent heat of   evaporation ( J g⁻¹ )2497
Latent heat of   fusion ( J g⁻¹ )59.60
Melting point   ( C )231.90
Specific heat   ( J K⁻¹ kg⁻¹ )213.0 @25°C
Thermal   conductivity ( W m⁻¹ K⁻¹ )66.80 @0-100°C


Chemical composition

Purity:4N(99.99%)

ElementValue
Ni1 PPM
Si5 PPM
Au1 PPM
Tl1 PPM
Bi2 PPM
Fe2 PPM
Ag<1 PPM
In<1 PPM
Pb10 PPM
Al<1 PPM
Cd1 PPM
Cu<1 PPM
Mg1 PPM

We can customized as required


Applications of Tin Ingot

High purity Tin metal is widely used in manufacture of compound semiconductor, high purity alloy, superconducting material, solder and as a dopant of compound semiconductor.


• Polished tin and tin alloys are used as a protective coat for other metals. It provides a protective oxide layer to prevent oxidation. such as in tin cans, which are made of tin-coated steel.


• Tin-iron alloys are used for coating lead or zinc and steel to prevent corrosion. A niobium-tin alloy is used for superconducting magnets. Alloys of tin are important, such as soft solder, pewter, bronze and phosphor bronze.


• Tin-plated steel containers are widely used for food preservation.


• Tin has also sometimes been used in coinage.


Tin has many uses.Most window glass is made by floating molten glass on molten tin to produce a flat surface. Tin salts sprayed onto glass are used to produce electrically conductive coatings. The most important tin salt used is tin(II) chloride, which is used as a reducing agent and as a mordant for dyeing calico and silk. Tin(IV) oxide is used for ceramics and gas sensors. Zinc stannate (Zn2SnO4) is a fire-retardant used in plastics. ATT manufactures ultra high purity tin metal in various forms for advanced thin film deposition technologies such as PVD, MBE, E-beam, and vacuum deposition. High purity tin metal is used to produce transparent conductive oxide (TCO) glasses such as indium tin oxide (ITO) and compound semiconductors such as tin selenide. High purity tin is also suitable as an alloy additive for electronic solders or a reference material for impurity analysis. Forms include evaporation pieces, granules, and others. Tin can be combined with various elements to form a wide variety of useful alloys. Tin is frequently alloyed with copper. Pewter, another frequently used Tin alloy, is 85–99% tin and 1-15% copper, antimony, bismuth and lead. Tin is also a constituent of bronzes, pewter, certain bearing materials and fusible alloys.

Packing of Tin Ingot

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’ Tin Ingot is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.


Chemical Identifiers

Linear FormulaSn
MDL NumberMFCD00133862
CAS7440-31-5
EC No.231-141-8
IUPAC Nametin
Pubchem CID5352426
SMILES[Sn]
InchI IdentifierInChI=1S/Sn
InchI KeyATJFFYVFTNAWJD-UHFFFAOYSA-N


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