Product Code : AL-EM-Cu
Tungsten was used extensively for the filaments of old-style incandescent light bulbs, but these have been phased out in many countries. This is because they are not very energy efficient; they produce much more heat than light.Tungsten has the highest melting point of all metals and is alloyed with other metals to strengthen them. Tungsten and its alloys are used in many high-temperature applications, such as arc-welding electrodes and heating elements in high-temperature furnaces.
Epoxy Molding Compounds is powdered plastic with a high tracking resistance index, good arc resistance, excellent electrical performance, high notch impact, flame retardant, good heat resistance, abrasion resistance, and low water absorption. The room temperature storage period is more than one year.
ATT is a professional supplier of Epoxy Molding Compounds (EM-200), We also produce disc, granules, ingot, pellets, pieces, powder, rod, wire, sputtering target and in numerous other forms and custom shapes. Other shapes are available by request.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
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Product Information
Tungsten was used extensively for the filaments of old-style incandescent light bulbs, but these have been phased out in many countries. This is because they are not very energy efficient; they produce much more heat than light.Tungsten has the highest melting point of all metals and is alloyed with other metals to strengthen them. Tungsten and its alloys are used in many high-temperature applications, such as arc-welding electrodes and heating elements in high-temperature furnaces.
Epoxy Molding Compounds is powdered plastic with a high tracking resistance index, good arc resistance, excellent electrical performance, high notch impact, flame retardant, good heat resistance, abrasion resistance, and low water absorption. The room temperature storage period is more than one year.
ATT is a professional supplier of Epoxy Molding Compounds (EM-200), We also produce disc, granules, ingot, pellets, pieces, powder, rod, wire, sputtering target and in numerous other forms and custom shapes. Other shapes are available by request.
Synonyms
Epoxy Molding Compounds (EM-200)
| Material | EMC |
| Density | 1.9~2.1 (g/cm3) |
| Water absorption | ≤20 mg (1d/23℃) |
| Appearance | Red powder |
Per your request or drawing
We can customized as require
Epoxy Molding Compounds (EM-200) Specification
| Performance | Epoxy Molding Compounds (EM-200) |
| Density | 1.9~2.1 g/cm3 |
| Water absorption (1d / 23℃) | ≤ 20 mg |
| Mold shrinkage | 0.4~0.8 % |
| Bending strength | ≥ 60 MPa |
| Surface resistivity | ≥ 1.0 × 1012 Ω |
| Volume resistivity | ≥ 1.0 × 1010 Ω·m |
| Electric strength | ≥ 12.0 MV/m |
| Comparative tracking index | ≥ 600 V |
| Arc resistance | ≥ 180 s |
| Thermal deformation temperature under load | ≥ 200 ℃ |
| Flammability (model thickness 3.2 mm) | FV-0 (UL94) |
| Color | Red |
| Product form | powder |
Applications of Epoxy Molding Compounds (EM-200)
Epoxy Molding Compounds (EM-200) is one of the most common and important packaging materials for modern semiconductor packaging.
Packing of Epoxy Molding Compounds (EM-200)
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Epoxy Molding Compounds (EM-200) is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Reference molding process conditions:
| Injection Molding | Mold temperature (℃) | Barrel temperature(℃) | Injection pressure(MPa) | Curing time(s/mm) | ||
| Dynamic model | Fixed mold | Anterior segment | Back section | |||
| Epoxy Molding Compounds (EM-200) | 165 ~ 175 | 165 ~ 175 | 80 ~ 90 | 50 ~ 70 | 60 ~ 100 | 25 ~ 40 |
| Compression Molding | Mold temperature(℃) | Forming pressure(MPa) | Curing time(s/mm) |
| Epoxy Molding Compounds (EM-200) | 165 ~ 175 | 15 ~ 20 | 40 ~ 60 |
