Product Code : ME-W-99.999%-DI
Tungsten disc are widely used in contact materials of thyristor rectifier diodes, transistors and thyristors. Tungsten has a coefficient of thermal expansion (CTE) similar to silicon and has moderate thermal conductivity, so it is suitable for large area power devices that generate large amounts of heat. Further applications include the use of tungsten as a cooling base in integrated circuits, large-scale integrated circuits, and hybrid circuits.Tungsten disc has quite high purity, generally purity ≥ 99.95%.
ATT can design and manufacture Tungsten disc beyond the standard size according to customer requirements.
CAS #: 7440-33-7
Linear Formula: W
MDL Number: MFCD00011461
EC No.: 231-143-9
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| Product | Product Code | Purity | Size | Contact Us |
Product Information
Tungsten disc are widely used in contact materials of thyristor rectifier diodes, transistors and thyristors. Tungsten has a coefficient of thermal expansion (CTE) similar to silicon and has moderate thermal conductivity, so it is suitable for large area power devices that generate large amounts of heat. Further applications include the use of tungsten as a cooling base in integrated circuits, large-scale integrated circuits, and hybrid circuits.Tungsten disc has quite high purity, generally purity ≥ 99.95%.
ATT can design and manufacture Tungsten disc beyond the standard size according to customer requirements.
Synonyms
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Specifications Of Tungsten disc
| Size | 1.0–150mm Dia x 0.1–20mm T |
| Material | Tungsten |
| Standard | ASTM B760 |
| Purity | ≥99.95% |
ATT can design and manufacture according to customer's requirements beyond the standard size.
Chemical Composition for Tungsten disc
| Product | Tungsten content | Impurity content | |
| Total content | Content per element | ||
| W Disc | ≥99.95% | ≤0.05% | ≤0.01% |
Tungsten disc Properties
| Molecular Weight | 183.85 |
| Appearance | Silvery |
| Melting Point | 3410 °C |
| Boiling Point | 5900 °C |
| Density | 19.3 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 5.65 μΩ ·m (27 °C) |
| Electronegativity | 1.7 Paulings |
| Heat of Fusion | 35.3 kJ/mol |
| Heat of Vaporization | 806.7 kJ/mol |
| Poisson's Ratio | 0.28 |
| Specific Heat | 0.133 J/g mol (20 °C) |
| Tensile Strength | 750 MPa |
| Thermal Conductivity | 1.73 W/m K |
| Thermal Expansion | (25 °C) 4.5 µm·m-1·K-1 |
| Vickers Hardness | 3430 MPa |
| Young's Modulus | 411 GPa |
Applications of Tungsten disc
Tungsten discs and tungsten squares are widely used as contact materials in silicon-controlled rectifier diodes, transistors, and thyristors.
Packaging of Tungsten disc
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’Tungsten disc is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | W |
| CAS | 7440-33-7 |
| MDL Number | MFCD00011461 |
| EC No. | 231-143-9 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23964 |
| SMILES | [W] |
| InchI Identifier | InChI=1S/W |
| InchI Key | WFKWXMTUELFFGS-UHFFFAOYSA-N |
